Cooling gas delivery system for a rotatable semiconductor substrate support assembly
March 28, 2021. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent ReferencesApparatus for controlling thermal transfer in a cyclic vacuum processing system Method and apparatus for drying semiconductor wafers Apparatus for mounting workpieces Substrate transport and cooling apparatus and method for same Vacuum treatment apparatus and vacuum treatment method Spin coating apparatus using a tilting chuck Apparatus and method for treating flat substrate under reduced pressure in the manufacture of electronic devices Physical vapor deposition clamping mechanism and heater/cooler Method and apparatus for thermally insulating a wafer support Semiconductor wafer processing method and apparatus with heat and gas flow control InventorsApplicationNo. 820497 filed on 03/28/2001US Classes:118/730, Rotary118/724, By means to heat or cool156/345.53, With means to cool the workpiece support156/345.55With means to cause rotary movement of the workpieceExaminersPrimary: Hassanzadeh, ParvizAssistant: Moore, Karla Attorney, Agent or FirmForeign Patent References
International ClassC23C 016/00AbstractA semiconductor substrate support apparatus comprises a support chuck having at least one chuck manifold extending through the support chuck, and a rotatable shaft coupled to the support chuck. The shaft has at least one shaft conduit disposed therein and extends through the support chuck. A housing circumscribes the shaft and has a housing conduit adapted for connection to a gas source. A plurality of seals are disposed between the shaft and the housing and thereby define a radial passageway between the at least one shaft conduit and the housing conduit for providing a backside gas to a backside of a wafer disposed on the rotating support chuck.Other References
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