Systems and methods for sensing an acoustic signal using microelectromechanical systems technology
Patent 6688169 Issued on February 10, 2004. Estimated Expiration Date: 
June 15, 2021. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
June 15, 2021. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent ReferencesMethod of making superhard mechanical microstructures CMOS integrated microsensor with a precision measurement circuit Micromachined hot-wire shear stress sensor All-metal, giant magnetoresistive, solid-state component Micro-electro-mechanics systems (MEMS) Thin film electret microphone Patent #: 6243474 InventorsAssigneeApplicationNo. 881793 filed on 06/15/2001US Classes:73/170.13, Acoustic73/514.35, Electric73/720, Strain gauge73/721PiezoresistiveExaminersPrimary: Lefkowitz, EdwardAssistant: Ellington, Alandra Attorney, Agent or FirmInternational ClassG01F 013/00AbstractAn acoustic system has an acoustic sensor and a processing circuit. The acoustic sensor includes a base, a microphone having a microphone diaphragm supported by the base, and a hot-wire anemometer having a set of hot-wire extending members supported by the base. The set of hot-wire extending members defines a plane which is substantially parallel to the microphone diaphragm. The processing circuit receives a sound and wind pressure signal from the microphone and a wind velocity signal from the hot-wire anemometer, and provides an output signal based on the sound and wind pressure signal from the microphone and the wind velocity signal from the hot-wire anemometer (e.g., accurate sound with wind noise removed). The configuration of the hot-wire extending members defining a plane which is substantially parallel to the microphone diaphragm can be easily implemented in a MEMS device making the configuration suitable for miniaturized applications.Other References
Field of SearchMagnetic fieldStrain sensors With means to concentrate stress Acoustic wave With thinned central active portion of semiconductor surrounded by thick insensitive portion (e.g. diaphragm type strain gauge) Physical deformation RESPONSIVE TO NON-ELECTRICAL SIGNAL (E.G., CHEMICAL, STRESS, LIGHT, OR MAGNETIC FIELD SENSORS) Means to reduce sensitivity to physical deformation Acoustic Electrostatic restoring means Temperature compensator Temperature Semiconductor Strain gauge Piezoresistive Piezoresistive With substrate carrier (e.g., thin film) Specified sensor structure Making named article ETCHING OF SEMICONDUCTOR MATERIAL TO PRODUCE AN ARTICLE HAVING A NONELECTRICAL FUNCTION | |
