Heat sink/heat spreader structures and methods of manufacture
Patent 6686532 Issued on February 3, 2004. Estimated Expiration Date: 
September 18, 2020. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
September 18, 2020. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent References 3097027 3615870 3635037 3663307 Thermoelectric pillow and blanket Thermoelectric heat pump/power source device High performance thermoelectric materials and methods of preparation Thermoelectric cooling module and method for manufacturing the same Thermoelectric coolers with enhanced structured interfaces Patent #: 6384312 InventorApplicationNo. 664121 filed on 09/18/2000US Classes:136/204, Including additional heat exchange means62/3.3, Heat pump, selective heating and cooling136/205, Electric power generator257/930THERMOELECTRIC (E.G., PELTIER EFFECT) COOLINGExaminersPrimary: Ryan, PatrickAssistant: Parsons, Thomas H. Attorney, Agent or FirmInternational ClassesH01L 035/28H01L 035/30 F25B 021/02 AbstractA heat sink/heat spreader structure utilizing thermoelectric effects to efficiently transport thermal energy from a variety of heat sources including integrated circuits and other electronic components. A method for manufacturing the heat sink/spreader is also disclosed.Field of SearchPeltier effect deviceIncluding additional heat exchange means Having strip, film or plate-type thermocouples Thermoelectric; e.g., peltier effect Heat pump, selective heating and cooling THERMOELECTRIC (E.G., PELTIER EFFECT) COOLING With provision for cooling the housing or its contents For integrated circuit Isolation of cooling means (e.g., heat sink) by an electrically insulating element (e.g., spacer) Heat dissipating element held in place by clamping or spring means Pressed against semiconductor element With fins | |
