Package for a semiconductor device
Package structure having accessible chip
Covers for micromechanical sensors and other semiconductor devices
Optical semiconductor device with convergent lens Patent #: 6288851
ApplicationNo. 10/283494 filed on 10/30/2002
US Classes:438/108, Flip-chip-type assembly257/680, With window means257/690, With contact or lead257/692, With particular lead geometry257/778Flip chip
ExaminersPrimary: Fahmy, Wael
Assistant: Ha, Nathan W.
Attorney, Agent or Firm
International ClassB81B 7/00 (20060101)
AbstractA low-cost ceramic package, in land-grid array or ball-grid array configuration, for micromechanical components is fabricated by coating the whole integrated circuits wafer with a protective material, selectively etching the coating for solder ball attachment, singulating the chips, flip-chip assembling a chip onto the opening of a ceramic substrate, underfilling the gaps between the solder joints with a polymeric encapsulant, removing the protective material form the components, and attaching a lid to the substrate for sealing the package. It is an aspect of the present invention to be applicable to a variety of different semiconductor micromechanical devices, for instance actuators, motors, sensors, spatial light modulators, and deformable mirror devices. In all applications, the invention achieves technical advantages as well as significant cost reduction and yield increase.