Apparatus for cutting stone panels
Rigid wire saw wheel apparatus for very hard materials
Tile saw apparatus and method
Apparatus and method for slicing a workpiece utilizing a diamond impregnated wire
Method for sawing wafers employing multiple indexing techniques for multiple die dimensions Patent #: 6119675
ApplicationNo. 09/913214 filed on 08/08/2001
US Classes:451/178, Rotary cylinder125/13.01, Rotary125/15, Saw blades451/411, WORK TABLE83/477.2Work-support includes passageway for tool (e.g., slotted table)
ExaminersPrimary: Morgan, Eileen P.
International ClassesB23D 47/12 (20060101)
B23D 47/00 (20060101)
B28D 1/04 (20060101)
B28D 1/02 (20060101)
AbstractThe present invention relates to a blade ring saw assembly in which the blade is a narrow, flat-sided metal ring having a radial width at least twice, and preferably four to six times, its thickness and has a diamond abrasive coating covering its outer peripheral edge and a portion of each sidewall of the ring. The blade ring is supported on a base from beneath the working surface, and projects upwardly to expose more than one-half of the blade ring for cutting of hard and thick workpieces, such as tile and stone, including both curved cutting and straight cutting. The blade ring is supported beneath the work surface by a plurality of roller guides above its radially inner edge and an endless drive belt having a run that extends beneath the blade ring so as to both support and drive the blade ring. Side-motion inhibiting roller guides are positioned immediately beneath the primary cutting area, to restrict lateral displacement of the blade ring during cutting, and similar roller guides optionally are provided on a stabilizer arm over the blade ring, also having a wiper serving to block coolant carried by the blade ring from a reservoir in the base.