Automated process monitoring and analysis system for semiconductor processing
April 13, 2020. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent References 3751647 Method for producing semiconductor devices Method of diagnosing malfunctions in semiconductor manufacturing equipment Method for controlling semiconductor wafer processing Semiconductor simulator tool for experimental N-channel transistor modeling Dynamic process window control using simulated wet data from current and previous layer data Method and apparatus for monitoring processes using multiple parameters of a semiconductor wafer processing system Method for monitoring and analyzing manufacturing processes using statistical simulation with single step feedback Method for predicting performance of microelectronic device based on electrical parameter test data using computer model Automatic recipe adjust and download based on process control window InventorsAssigneeApplicationNo. 09/548779 filed on 04/13/2000US Classes:700/121, Integrated circuit production or semiconductor fabrication257/E21.525, Procedures, i.e., sequence of activities consisting of plurality of measurement and correction, marking or sorting steps (EPO)438/10, Electrical characteristic sensed438/17, Electrical characteristic sensed700/108, Performance monitoring700/30Comparison with model (e.g., model reference)ExaminersPrimary: Picard, Leo P.Assistant: Rodriguez, Saul Attorney, Agent or FirmInternational ClassesG03F 7/20 (20060101)H01L 21/66 (20060101) AbstractA method is provided for manufacturing, the method comprising processing a workpiece, measuring a parameter characteristic of the processing, and forming an output signal corresponding to the characteristic parameter measured by using the characteristic parameter measured as an input to a transistor model. The method also comprises predicting a wafer electrical test (WET) resulting value based on the output signal, detecting faulty processing based on the predicted WET resulting value, and correcting the faulty processing.Other References
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