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US Patent 6618134 - Sample inspection system

US Patent Issued on September 9, 2003
Estimated Patent Expiration Date: Icon_subject December 27, 2021Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
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Abstract

A curved mirrored surface is used to collect radiation scattered by a sample surface and originating from a normal illumination beam and an oblique illumination beam. The collected radiation is focused to a detector. Scattered radiation originating from the normal and oblique illumination beams may be distinguished by employing radiation at two different wavelengths, by intentionally introducing an offset between the spots illuminated by the two beams or by switching the normal and oblique illumination beams on and off alternately. Beam position error caused by change in sample height may be corrected by detecting specular reflection of an oblique illumination beam and changing the direction of illumination in response thereto. Butterfly-shaped spatial filters may be used in conjunction with curved mirror radiation collectors to restrict detection to certain azimuthal angles.

Other References

  • Y Yatsugake et al., "Surface Inspection System for Estimation of Wafer," Hitachi Electronics Engineering Technical Report, vol. 11, Jan. 1996, pp.21-26
  • Figure, Hitachi Electronics Engineering Co., Ltd., presented by Etsuro Morita of Mitsubishi Materials Silicon Corp. in a presentation entitled "Exploration of COP and COP Defect Crystal Originated `Particles`," at the Sixth International Workshop and 300 Millimeter Wafers on Dec. 5, 1996 in Mauhari, Japan
  • Partial Search Report dated Oct. 18, 2000
  • Search Report Corresponding to PCT Application No. PCT/US98/19564 issued by the International Patent Office on Feb. 8, 1999

Inventors

Application

No. 10/033069 filed on 12/27/2001

US Classes:

356/237.4, On patterned or topographical surface (e.g., wafer, mask, circuit board)356/237.5On patterned or topographical surface (e.g., wafer, mask, circuit board)

Field of Search

356/394, With comparison to master, desired shape, or reference voltage356/237.1, INSPECTION OF FLAWS OR IMPURITIES356/237.2, Surface condition356/237.3, Detection of object or particle on surface356/237.4, On patterned or topographical surface (e.g., wafer, mask, circuit board)356/237.5, On patterned or topographical surface (e.g., wafer, mask, circuit board)356/369, Of surface reflection356/239.1, Transparent or translucent material356/239.2, Optical element (e.g., contact lens, prism, filter, lens, etc.)356/239.3Patterned surface

Examiners

Primary: Pham, Hoa Q.

Attorney, Agent or Firm

US Patent References

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International Classes

G01N 21/47 (20060101)
G01N 21/95 (20060101)
G01N 21/88 (20060101)

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