Apparatus and methods for manipulating semiconductor wafers
January 12, 2021. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent ReferencesSuction device Method and apparatus for handling and processing wafer-like materials Automated wafer inspection system Wafer inspection system Wafer processing machine vacuum front end method and apparatus Method and apparatus for polishing workpiece Wafer gripper Wafer stage apparatus for attracting and holding semiconductor wafer Vacuum processing apparatus with low particle generating wafer clamp Apparatus to hold and remove an integrated circuit chip on a cutting chuck Inventors
ApplicationNo. 09/759613 filed on 01/12/2001US Classes:279/158, MISCELLANEOUS414/755, Article reoriented by contact with fluid means414/806Of charging load-holding or -supporting element from source and transporting element to working, treating, or inspecting stationExaminersPrimary: Kramer, Dean J.Assistant: Fox, Charles A. Attorney, Agent or FirmInternational ClassesH01L 21/67 (20060101)H01L 21/683 (20060101) AbstractApparatus and methods for a wafer handling system that manipulates semiconductor wafers. The present invention includes an end effector having a vacuum chuck, an internal vacuum plenum, and a plurality of flow diverters positioned within the vacuum plenum to define vacuum distribution channels in fluid communication with respective vacuum ports of the vacuum chuck. The present invention also includes a vacuum chuck having flow diverters positioned in one or more internal vacuum plenums which are in fluid communication with the vacuum ports of the vacuum chuck. The flow diverters of the vacuum chucks adjust the vacuum pressure supplied to the vacuum ports such that, as vacuum ports are occluded by the wafer, the vacuum pressure is preferentially applied to unblocked vacuum ports for increasing the attractive force applied to unengaged portions of the wafer. The wafer handling system also includes a gas dispensing showerhead that may be positioned above a vacuum chuck for flattening the wafer so that a vacuum chuck can establish a secure engagement. The apparatus of the present invention has particularly utility for securing thin semiconductor wafers with a significant warpage. | |
