Patent References 732119 839356 D143471 3534510 3585764 3763665 Method for cutting ornamental transparent gemstones and products produced therefrom Process for cutting a diamond to provide an invisible mounting Diamond sawing process D337544 InventorApplicationNo. 097426 filed on 03/15/2002US Classes:63/32, GEMD11/89, Jewel, gem or signetD11/90FacetedExaminersPrimary: Chop, AndreaAttorney, Agent or FirmForeign Patent References
International ClassA44C 017/00AbstractDisclosed are a new diamond cutting method and a diamond shape or proportion giving an increased brightness and different brilliant colors to the cut jewel. A piece of diamond having a crown or bezel and a pavilion converging up and down from its girdle is prepared; the table of the crown is cut into a regular polygon having straight sides of an integer multiple of three; star facets, upper-main facets and paired upper-girdle facets are formed on the oblique annular surface between the polygonal table and the girdle; and lower-girdle facets and lower-main facets are cut on the pavilion. The height of the diamond piece is approximately 64% of the diameter of the girdle; the height of the crown is approximately 15.7%; the height of the pavilion is approximately 48.3%; and the largest width of the girdle is approximately 1.2 to 1.4%. The angle formed between the ridge of the crown and the ridge of the pavilion is approximately 77 degrees. | |