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US Patent 6570261 - Method and apparatus for injection molded flip chip encapsulation

US Patent Issued on May 27, 2003
Estimated Patent Expiration Date: Icon_subject April 8, 2022Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
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Abstract

The electrical connections of an integrated circuit chip assembly comprised of an integrated circuit chip attached to a substrate are encapsulated and reinforced with a high viscosity encapsulant material by dispensing the encapsulant material through an opening in the substrate into the space between the integrated circuit chip and the substrate. An integrated circuit chin assembly having a reinforced electrical interconnection which is more resistant to weakening as a result of stress created by differences in coefficient of thermal expansion between the integrated circuit chip and the substrate to which the integrated circuit chip is attached is produced.

Other References

  • IBM Technical Disclosure Bulletin vol. 36, No. 11, Nov. 1993 pp 59-60
  • Patent abstracts of Japan Pub. No. 08153820 dated Jun. 11, 1996
  • Patent abstracts of Japan Pub. No. 01191457 dated Aug. 1, 1989
  • Patent abstracts of Japan Pub. No. 09120976 dated May 6, 199

Inventors

Application

No. 118395 filed on 04/08/2002

US Classes:

257/778, Flip chip257/738, Ball shaped257/787, ENCAPSULATED257/E21.501, Providing fillings in container, e.g., gas fillings (EPO)257/E21.503, Encapsulation of active face of flip chip device, e.g., under filling or under encapsulation of flip-chip, encapsulation perform on chip or mounting substrate (EPO)257/E23.126Double encapsulation or coating and encapsulation (EPO)

Field of Search

257/687, Housing or package filled with solid or liquid electrically insulating material257/709, With specified insulator to isolate device from housing257/737, Bump leads257/738, Ball shaped257/778, Flip chip257/780Ball or nail head type contact, lead, or bond

Examiners

Primary: Talbott, David L.
Assistant: Cruz, Lourdes

Attorney, Agent or Firm

US Patent References

4143456, Semiconductor device insulation method
Issued on: 03/13/1979
Inventor: Inoue
4915607, Lead frame assembly for an integrated circuit molding system
Issued on: 04/10/1990
Inventor: Medders, et al.
5019673, Flip-chip package for integrated circuits
Issued on: 05/28/1991
Inventor: Juskey, et al.
5120678, Electrical component package comprising polymer-reinforced solder bump interconnection
Issued on: 06/09/1992
Inventor: Moore, et al.
5169056, Connecting of semiconductor chips to circuit substrates
Issued on: 12/08/1992
Inventor: Reele, et al.
5203076, Vacuum infiltration of underfill material for flip-chip devices
Issued on: 04/20/1993
Inventor: Banerji, et al.
5218234, Semiconductor device with controlled spread polymeric underfill
Issued on: 06/08/1993
Inventor: Thompson, et al.
5239198, Overmolded semiconductor device having solder ball and edge lead connective structure
Issued on: 08/24/1993
Inventor: Lin, et al.
5248710, Flip chip encapsulating compositions and semiconductor devices encapsulated therewith
Issued on: 09/28/1993
Inventor: Shiobara, et al.
5273938, Method for attaching conductive traces to plural, stacked, encapsulated semiconductor die using a removable transfer film
Issued on: 12/28/1993
Inventor: Lin, et al.
5292688, Solder interconnection structure on organic substrates and process for making
Issued on: 03/08/1994
Inventor: Hsiao, et al.
5302850, Semiconductor sealing mold
Issued on: 04/12/1994
Inventor: Hara
5371404, Thermally conductive integrated circuit package with radio frequency shielding
Issued on: 12/06/1994
Inventor: Juskey, et al.
5385869, Semiconductor chip bonded to a substrate and method of making
Issued on: 01/31/1995
Inventor: Liu, et al.
5420752, GPT system for encapsulating an integrated circuit package
Issued on: 05/30/1995
Inventor: Variot
5450283, Thermally enhanced semiconductor device having exposed backside and method for making the same
Issued on: 09/12/1995
Inventor: Lin, et al.
5623006, Solder interconnection
Issued on: 04/22/1997
Inventor: Papathomas
5663106, Method of encapsulating die and chip carrier
Issued on: 09/02/1997
Inventor: Karavakis, et al.
6369449Method and apparatus for injection molded flip chip encapsulation
Issued on: 04/09/2002
Inventor: Farquhar, et al.

Foreign Patent References

  • 0 690 499 EP. 01/21/1996

International Class

H01L 023/48

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