Bizarre Patents
Microwave Oven With Removable Storage Cassette in Dashboard of Motor Vehicle
A microwave oven adapted for use within a motor vehicle dashboard area. The microwave oven has a removable storage cassette, and slidable platforms for securing and serving containers of beverages and foods.
PatentStorm News
Make the Most of PatentStorm
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest patents by subscribing to an RSS feed.
Got questions? Ask a Patent Expert!
Registered users: Manage your profile, comments and alerts.
US Patent 6570261 - Method and apparatus for injection molded flip chip encapsulation
US Patent Issued on May 27, 2003
Estimated Patent Expiration Date:
April 8, 2022Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
Estimated Patent Expiration Date:
April 8, 2022Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.AbstractThe electrical connections of an integrated circuit chip assembly comprised of an integrated circuit chip attached to a substrate are encapsulated and reinforced with a high viscosity encapsulant material by dispensing the encapsulant material through an opening in the substrate into the space between the integrated circuit chip and the substrate. An integrated circuit chin assembly having a reinforced electrical interconnection which is more resistant to weakening as a result of stress created by differences in coefficient of thermal expansion between the integrated circuit chip and the substrate to which the integrated circuit chip is attached is produced.Other References
| InventorsApplicationNo. 118395 filed on 04/08/2002US Classes:257/778, Flip chip257/738, Ball shaped257/787, ENCAPSULATED257/E21.501, Providing fillings in container, e.g., gas fillings (EPO)257/E21.503, Encapsulation of active face of flip chip device, e.g., under filling or under encapsulation of flip-chip, encapsulation perform on chip or mounting substrate (EPO)257/E23.126Double encapsulation or coating and encapsulation (EPO)Field of Search257/687, Housing or package filled with solid or liquid electrically insulating material257/709, With specified insulator to isolate device from housing257/737, Bump leads257/738, Ball shaped257/778, Flip chip257/780Ball or nail head type contact, lead, or bondExaminersPrimary: Talbott, David L.Assistant: Cruz, Lourdes Attorney, Agent or FirmUS Patent References4143456, Semiconductor device insulation methodIssued on: 03/13/1979 Inventor: Inoue4915607, Lead frame assembly for an integrated circuit molding system Issued on: 04/10/1990 Inventor: Medders, et al.5019673, Flip-chip package for integrated circuits Issued on: 05/28/1991 Inventor: Juskey, et al.5120678, Electrical component package comprising polymer-reinforced solder bump interconnection Issued on: 06/09/1992 Inventor: Moore, et al.5169056, Connecting of semiconductor chips to circuit substrates Issued on: 12/08/1992 Inventor: Reele, et al.5203076, Vacuum infiltration of underfill material for flip-chip devices Issued on: 04/20/1993 Inventor: Banerji, et al.5218234, Semiconductor device with controlled spread polymeric underfill Issued on: 06/08/1993 Inventor: Thompson, et al.5239198, Overmolded semiconductor device having solder ball and edge lead connective structure Issued on: 08/24/1993 Inventor: Lin, et al.5248710, Flip chip encapsulating compositions and semiconductor devices encapsulated therewith Issued on: 09/28/1993 Inventor: Shiobara, et al.5273938, Method for attaching conductive traces to plural, stacked, encapsulated semiconductor die using a removable transfer film Issued on: 12/28/1993 Inventor: Lin, et al.5292688, Solder interconnection structure on organic substrates and process for making Issued on: 03/08/1994 Inventor: Hsiao, et al.5302850, Semiconductor sealing mold Issued on: 04/12/1994 Inventor: Hara5371404, Thermally conductive integrated circuit package with radio frequency shielding Issued on: 12/06/1994 Inventor: Juskey, et al.5385869, Semiconductor chip bonded to a substrate and method of making Issued on: 01/31/1995 Inventor: Liu, et al.5420752, GPT system for encapsulating an integrated circuit package Issued on: 05/30/1995 Inventor: Variot5450283, Thermally enhanced semiconductor device having exposed backside and method for making the same Issued on: 09/12/1995 Inventor: Lin, et al.5623006, Solder interconnection Issued on: 04/22/1997 Inventor: Papathomas5663106, Method of encapsulating die and chip carrier Issued on: 09/02/1997 Inventor: Karavakis, et al.6369449Method and apparatus for injection molded flip chip encapsulation Issued on: 04/09/2002 Inventor: Farquhar, et al. Foreign Patent References
International ClassH01L 023/48 |
