U.S. patents available from 1976 to present.
U.S. patent applications available from 2005 to present.

Integrated circuit device having an embedded heat slug

Patent 6570247 Issued on May 27, 2003. Estimated Expiration Date: Icon_subject December 30, 2017. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.

Patent References

Bubble generating tunnels for cooling semiconductor devices
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Patent #: 5070040
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Inventor: Pankove

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Inventors

Application

No. 001704 filed on 12/30/1997

US Classes:

257/707, Directly attached to semiconductor device165/80.2, Electrical component174/16.3, With heat sink257/706, With heat sink257/796, With heat sink embedded in encapsulant361/707Through support means

Examiners

Primary: Clark, Jasmine

Attorney, Agent or Firm

Foreign Patent References

  • 0297894 EP. 04/13/1989
  • 62-93963 JP 04/13/1987
  • 62-117351 JP 05/13/1987
  • 63-81956 JP. 04/13/1988
  • 2-276264 JP. 11/13/1990

International Classes

H01L 023/10
H01L 023/34
H01L 023/28
H05K 007/20

Abstract

An integrated circuit device having an embedded heat slug. The integrated circuit device comprises, in one embodiment, a semiconductor substrate having a frontside surface and backside surface. The semiconductor substrate includes an integrated circuit on the frontside surface. A heat slug is disposed in an opening in the backside surface of the semiconductor substrate adjacent the integrated circuit.

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