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Micro-opto-electromechanical devices and method therefor
Flip-chip micromachine package fabrication method
Module and method for interconnecting integrated circuits that facilitates high speed signal propagation with reduced noise Patent #: 6300161
ApplicationNo. 938359 filed on 08/23/2001
US Classes:438/612, Forming solder contact or bonding pad438/106, PACKAGING (E.G., WITH MOUNTING, ENCAPSULATING, ETC.) OR TREATMENT OF PACKAGED SEMICONDUCTOR438/108Flip-chip-type assembly
ExaminersPrimary: Nelms, David C.
Assistant: Le, Thao P.
Attorney, Agent or Firm
Foreign Patent References
International ClassH01L 021/44
AbstractA module bonded together at a microplatform and an improved method for making the module are provided. The method includes providing a micromechanical device including a first substrate, the microplatform, a first plurality of bonding sites on the microplatform, a micromechanical structure fabricated and supported on the microplatform and a support structure to suspend the microplatform above the first substrate. The method further includes providing a transistor circuit wafer including a second plurality of bonding sites thereon and integrated BiCMOS transistor circuits. The first and second plurality of bonding sites are aligned and compression bonded so that the microplatform is both electrically and mechanically coupled to the second substrate to form the module. The platform carrier wafer can be torn off, leaving bonded platforms behind on the substrate wafer. This allows small form factor merging of the two different technologies.