Semiconductor die package with improved thermal and electrical performance
January 15, 2022. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent ReferencesPackage for push-pull semiconductor devices Hybrid transistor Hybrid transistor Power MOSFET Transistor package Package for semiconductor elements having thermal dissipation means Power module using IMS as heat spreader Package for a power semiconductor die and power supply employing the same RF power package with a dual ground Lateral MOS transistor with weakly doped drain extension InventorsApplicationNo. 050428 filed on 01/15/2002US Classes:257/706, With heat sink257/589, Avalanche transistor257/678, HOUSING OR PACKAGE257/712, With provision for cooling the housing or its contents257/784, Wire contact, lead, or bond257/E21.512, Right-up bonding (EPO)257/E23.104, Characterized by shape of housing (EPO)257/E23.181Characterized by shape of container or parts, e.g., caps, walls (EPO)ExaminersPrimary: Fahmy, WaelAssistant: Nguyen, Dinh Q. Attorney, Agent or FirmInternational ClassesH01L 023/10H01L 023/34 AbstractA semiconductor die package is disclosed. In one embodiment, the package includes a semiconductor die comprising a vertical power transistor. A source electrode and a gate contact region are at the first surface of the semiconductor die. A drain electrode is at the second surface of the semiconductor die. A base member is proximate to the second surface of the semiconductor die and is distal to the first surface of the semiconductor die and a cover disposed over the first surface of the semiconductor die. The cover is coupled to the base member and is adapted to transfer beat away from the semiconductor die.Other References
Field of SearchCap or lidOf high thermal conductivity ceramic (e.g., BeO) With heat sink Directly attached to semiconductor device Entirely of metal except for feedthrough With specified insulator to isolate device from housing With specified means (e.g., lip) to seal base to cap With raised portion of base for mounting semiconductor chip With provision for cooling the housing or its contents For integrated circuit Liquid coolant Boiling (evaporative) liquid Cryogenic liquid coolant Isolation of cooling means (e.g., heat sink) by an electrically insulating element (e.g., spacer) Heat dissipating element held in place by clamping or spring means Pressed against semiconductor element Heat dissipating element has high thermal conductivity insert (e.g., copper slug in aluminum heat sink) With gas coolant With fins Die bond With adhesive means Wire contact, lead, or bond With housing or contact (i.e., electrode) means With specified electrode means Gate closely aligned to source region With charging or discharging by control voltage applied to source or drain region (e.g., by avalanche breakdown of drain junction) With overvoltage protective means HOUSING OR PACKAGE Ball or nail head type contact, lead, or bond | |
