Patent References 3462650 3622419 3836393 3919452 Modules comprising photo-cells Method of fabricating a photovoltaic module of a substantially transparent construction Endoscope using a chip carrier type solid state imaging device Multi-chip type image sensor Apparatus for operating a film camera Color image sensing assembly with multiple linear sensors and aligned filters InventorsAssigneeApplicationNo. 860672 filed on 05/21/2001US Classes:396/429, CAMERA COMBINED WITH OR CONVERTIBLE TO DIVERSE ART DEVICE257/680, With window means348/64, Combined electronic sensing and photographic film cameras348/294, Solid-state image sensor348/340With optics peculiar to solid-state sensorExaminersPrimary: Gray, David M.Attorney, Agent or FirmInternational ClassesH01L 023/02H04N 005/225 Foreign Application Priority Data1996-09-09 ILAbstractAn imaging device and a camera with an imaging device for imaging and digital photography are provided. The imaging device includes an imaging die having an electrical circuit on a surface thereof, a glass cover having a first surface and a second surface, and connecting means for connecting the first surface of the glass cover to the surface of the imaging die, wherein the connecting means have a refractive index substantially equal to the refractive index of the glass cover. The connecting means may include spectral filtering means. The first surface of the glass cover may be coated with spectral filtering means.Field of SearchCAMERA COMBINED WITH OR CONVERTIBLE TO DIVERSE ART DEVICECAMERA DETAIL Body structure or housing Rear door or latch detail Electronic With electrical contact in hole in semiconductor (e.g., lead extends through semiconductor body) With window means Combined electronic sensing and photographic film cameras Solid-state image sensor Optics With optics peculiar to solid-state sensor | |