Low cost electroless plating process for single chips and wafer parts and products obtained thereof
Patent 6548327 Issued on April 15, 2003. Estimated Expiration Date: 
April 24, 2021. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
April 24, 2021. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent ReferencesMulti chip module with conductive adhesive layer Method of making components with solder balls Bumpless flip chip assembly with solder via Semiconductor device and method of fabricating the same Patent #: 6329228 InventorsAssigneeApplicationNo. 841359 filed on 04/24/2001US Classes:438/118, Including adhesive bonding step257/E21.174, From a liquid, e.g., electrolytic deposition (EPO)257/E21.508Forming solder bumps (EPO)ExaminersPrimary: Nelms, David C.Assistant: Le, Thao P. Attorney, Agent or FirmInternational ClassH01L 021/44AbstractThe present invention is related to a method for electroless plating Nickel/Gold on aluminium bonding pads of single chips or wafer parts. This method result in uniformly plated singulated chips, single dice or wafer parts in a much more simple and cost-effective way. The proposed method comprises the steps of attaching to die or wafer part to a non-conductive adhesive or substrate.Other References
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