Patent ReferencesNon-contact I/O signal transmission in integrated circuit packaging Optoelectronic interconnections for III-V devices on silicon Optoelectronic transmitter and receiver Information processing apparatus including a planar optical waveguide Optical switching in a fiber communication system and method using same Chuted, optical packet distribution network Substrate-embedded pluggable receptacles for connecting clustered optical cables to a module Semiconductor device having an optical waveguide interposed in the space between electrode members Parallel optical interconnect Optoelectronic interface and method of making InventorApplicationNo. 687337 filed on 10/13/2000US Classes:385/89, Plural fiber/device connections385/88, Optical fiber to a nonfiber optical device connector385/116Imaging (i.e., with coherent fiber structure and includes shaping, enhancing, and correcting)ExaminersPrimary: Bovernick, Rodney B.Assistant: Pak, Sung Attorney, Agent or FirmForeign Patent References
International ClassG02B 006/36AbstractAn apparatus for efficiently transferring data on and off of an integrated circuit in a network node. In one embodiment, the chip has a silicon substrate and direct interconnection with optical fibers. In particular, the present invention pertains to an arrangement of the transmitters and receivers, along with processing circuitry and optical fibers, so signals are routed most efficiently for a given type of architecture, such as ring, star, routers, and crossbars. In one embodiment, the transmitters and receivers are interdigitated to provide bi-directional optical channels. An additional feature of the invention is the mating of the optical fibers to the transmitters and receivers, such that there is a direct correspondence on both ends of the optic fibers. The optical fibers of the transmitters and receivers can be grouped or bundled together to allow reconfiguration of different topology or to improve system performance by bundling together certain fibers.Other References
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