Patent ReferencesImpedance matching network comprising selectable capacitance pads and selectable inductance strips or pads Sub power plane to provide EMC filtering for VLSI devices Printed-circuit assembly Patent #: 6166457 Inventors
AssigneeApplicationNo. 688047 filed on 10/12/2000US Classes:361/760, Connection of components to board361/502, Double layer electrolytic capacitor361/763, Capacitor and electrical component361/765, By direct coating of components on board361/811With passive componentsExaminersPrimary: Martin, DavidAssistant: Bui, Hung Attorney, Agent or FirmForeign Patent References
International ClassesH05K 007/02H05K 007/10 Foreign Application Priority Data1999-10-15 JPAbstractPrinted circuit board 1 on which LSI2 is mounted comprises first capacitors 4a and 4b for electrically connecting power source terminals 3a and 3b to via holes 8b, first power source wiring 5a, second power source wiring 6a and a second capacitor 7a. In a predetermined frequency range, the characteristic impedances in power source wirings 5a and 6a are set to three times or more higher than the impedances in capacitors 4a, 4b and 7a. In addition, the lengths of power source wirings 5a and 6a are set to equal to or larger than a value obtained by multiplying 20 mm by the wavelength reduction rate of the printed circuit board and equal to or smaller than a value obtained by multiplying one quarter the wavelength at the upper limit frequency in the predetermined frequency range by the wavelength reduction rate.Field of SearchConnection of components to boardHaving spring member Capacitor and electrical component By direct coating of components on board With specific lead configuration By specific pattern on board Power, voltage, or current layer With passive components Double layer electrolytic capacitor With plurality of capacitors For capacitor and inductor | |