Hot lamination process for the manufacture of a combination contact/contactless smart card
August 5, 2019. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent ReferencesMethod of producing personalized badges and the like Identification card with an IC-module and method for producing it Method of manufacturing an electronic identification card Data carrier having an integrated circuit and method for producing same Personal memory card having a contactless interface using differential data transfer IC card IC card and method of manufacturing the same Flexible printed circuit IC package and IC card incorporating the same thereinto Electronic microcircuit card and method for its manufacture InventorApplicationNo. 368846 filed on 08/05/1999US Classes:156/153, With abrading or grinding of lamina156/154, Subsequent to assembly156/277With printingExaminersPrimary: Aftergut, Jeff H.Attorney, Agent or FirmForeign Patent References
International ClassG06K 019/077AbstractA plastic smart card, such as a card having a radio frequency identification (RFID) proximity function, including at least one electronic element embedded therein and a physical contact card function and the hot lamination process for the manufacture of this dual function smart card and other plastic cards including a micro-chip embedded therein. The process results in a card having a preferred overall thickness in the range of 0.028 inches to 0.032 inches with a surface suitable for receiving dye sublimation printing--the variation in card thickness across the surface should not exceed 0.0005 inches. A card manufactured in accordance with the present invention also complies with all industry standards and specifications. Also, the hot lamination process of the present invention results in an aesthetically pleasing card. The invention also relates to a plastic card formed in accordance with the hot lamination process of the present invention. | |
