Test carrier for packaging semiconductor components having contact balls and calibration carrier for calibrating semiconductor test systems
July 21, 2020. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent ReferencesOvermolded semiconductor device having solder ball and edge lead connective structure Liquid encapsulated ball grid array semiconductor device with fine pitch wire bonding Apparatus for testing integrated circuits Top loading test socket for ball grid arrays Method for making interconnects and semiconductor structures using electrophoretic photoresist deposition Ball grid array socket Method of producing a single piece package for semiconductor die Method for forming an interconnect having a penetration limited contact structure for establishing a temporary electrical connection with a semiconductor die Carrier having slide connectors for testing unpackaged semiconductor dice Temporary semiconductor package having hard-metal, dense-array ball contacts and method of fabrication InventorApplicationNo. 621121 filed on 07/21/2000US Classes:324/755, Internal of or on support for device under test (DUT)324/757, Probe contact enhancement324/765Test of semiconductor deviceExaminersPrimary: Sherry, Michael J.Assistant: Hollington, Jermele Attorney, Agent or FirmInternational ClassesG01R 031/02G01R 031/26 AbstractA test carrier for testing bumped semiconductor components such dice, chip scale packages, BGA devices, and wafers is provided. The test carrier includes a base for retaining one or more components and contact members for making temporary electrical connections with contact balls on the components (e.g., solder balls). The test carrier also includes terminal contacts formed as hard metal balls, as hard metal balls coated with a non-oxidizing metal layer, or as glass, ceramic or plastic members coated with a conductive material. The contact members on the base protect the contact balls on the components from deformation during testing and handling. The terminal contacts on the test carrier are configured for multiple uses in a production environment without deformation.Also provided is a calibration carrier for calibrating semiconductor test systems for bumped components, and a cleaning carrier for cleaning test sockets for bumped components. The calibration carrier can include on board evaluation circuitry for evaluating electrical characteristics of a test system, such as contact resistances between electrical connectors of a test socket and terminal contacts on the calibration carrier. The cleaning carrier includes terminal contacts formed of a solder wettable material configured to attract solder contaminants in test sockets.Other References
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