Compact thermoelectric cooling system
October 10, 2021. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent References 3121998 Temperature stabilization method Integrated circuit temperature gradient and moisture regulator Isolation chamber for electronic devices Control circuitry for thermoelectric cooler Downhole thermoelectric refrigerator Thermoelectric power generating device Controlled power converter for thermoelectric heat pump drive Device and method for determining freezing points Thermoelectric cooling system and method InventorAssigneeApplicationNo. 974078 filed on 10/10/2001US Classes:62/129, Condition sensing62/3.3, Heat pump, selective heating and cooling62/3.7Including specific circuitry or heat exchanger materialExaminersPrimary: Jiang, Chen-WenAttorney, Agent or FirmInternational ClassesG01K 013/00F25B 021/02 AbstractA compact self-contained thermoelectric cooler (TEC) is provided by utilizing a DC to DC active power supply to provide compact size. The compactness and flatness of the DC to DC active power supply allows the unit to be completely self-contained. The compactness and flatness of the DC to DC active power supply allow the power supply assembly to be located on the hot side of the TEC. A non-planar barrier between the hot side and cold side of the TEC also provides compactness and allows the TEC to be completely self-contained. A mounting frame is disposed between the hot and cold side. The mounting frame includes a power pack cutout allowing a non-planar barrier between the hot and cold side. Electrical components of the power supply are mounted to a power pack heat sink. The power pack heat sink is attached to the mounting frame with electrical components protruding through the power pack cutout. Power pack cover is attached to the cold side of the mounting frame, encapsulating the electrical components and creating a non-planar barrier between the hot side and the cold side of the TEC. The TEC includes several moisture resistant barriers and thermally isolating barriers to improve performance and longevity. A moisture resistant barrier is provided around at least one thermoelectric module and around a power supply assembly. A non-planar thermally isolating barrier is provided between the hot side and cold side of the TEC. A power control system is provided to deliver maximum cooling power for a given design and a give set of operating conditions. Finally, a dual power supply may be provided to increase reliability.Field of SearchIncluding specific circuitry or heat exchanger materialThermoelectric; e.g., peltier effect Operatively correlated with automatic control Condition sensing With electrical component cooling Selective heating or cooling Temperature sensor controlling temperature Having additional contact means for sensing solid work With transistor control means in the line circuit Cooperating separate sensing and control means Including plural sensing or control means With transistor as control means in the line circuit | |
