Mounting device for an electronic component
Mass simultaneous sealing and electrical connection of electronic devices
Surface acoustic wave device mounted module
Electronic device having a chip with an external bump terminal equal or smaller than a via hole on a board
Vertical-type transistor device, having a bump electrode that has a shape with no interior angle exceeding 270° Patent #: 5831337
ApplicationNo. 387984 filed on 09/01/1999
US Classes:310/344, Sealed unit310/348, With mounting or support means310/363, Electrode materials310/365Electrode arrangement
ExaminersPrimary: Dougherty, Thomas M.
Attorney, Agent or Firm
Foreign Patent References
International ClassH03H 009/25
Foreign Application Priority Data1998-09-02 JP
AbstractAn electronic component comprises a substrate having a surface on which an electrode is formed and an SAW circuit element having a surface on which a circuit is formed. The circuit element is held such that the surface of the circuit element and the surface of the substrate are opposed to each other. A bump electrode joins the circuit on the circuit element and the electrode of the substrate together, and a sealing material joins the circuit element and the substrate together in the periphery of the space between the circuit-forming surface of the circuit element and the substrate. The space between the circuit-forming surface of the circuit element and the substrate is hermetically sealed by the circuit element, the substrate, and the sealing material. Advantageously, a low-temperature soldering material such as solder, or an adhesive, is used as the sealing material.