Electronic component such as an saw device and method for producing the same
Patent 6498422 Issued on December 24, 2002. Estimated Expiration Date: 
September 1, 2019. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
September 1, 2019. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent ReferencesMounting device for an electronic component Mass simultaneous sealing and electrical connection of electronic devices Surface acoustic wave device mounted module Electronic device having a chip with an external bump terminal equal or smaller than a via hole on a board Vertical-type transistor device, having a bump electrode that has a shape with no interior angle exceeding 270° Patent #: 5831337 InventorAssigneeApplicationNo. 387984 filed on 09/01/1999US Classes:310/344, Sealed unit310/348, With mounting or support means310/363, Electrode materials310/365Electrode arrangementExaminersPrimary: Dougherty, Thomas M.Attorney, Agent or FirmForeign Patent References
International ClassH03H 009/25Foreign Application Priority Data1998-09-02 JPAbstractAn electronic component comprises a substrate having a surface on which an electrode is formed and an SAW circuit element having a surface on which a circuit is formed. The circuit element is held such that the surface of the circuit element and the surface of the substrate are opposed to each other. A bump electrode joins the circuit on the circuit element and the electrode of the substrate together, and a sealing material joins the circuit element and the substrate together in the periphery of the space between the circuit-forming surface of the circuit element and the substrate. The space between the circuit-forming surface of the circuit element and the substrate is hermetically sealed by the circuit element, the substrate, and the sealing material. Advantageously, a low-temperature soldering material such as solder, or an adhesive, is used as the sealing material.Other References
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