U.S. patents available from 1976 to present.
U.S. patent applications available from 2005 to present.

Edge-gripping pre-aligner

Patent 6468022 Issued on October 22, 2002. Estimated Expiration Date: Icon_subject July 5, 2020. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.

Patent References

Wafer alignment station
Patent #: 4457664
Issued on: 07/03/1984
Inventor: Judell ,   et al.

Transport mechanism
Patent #: 4749330
Issued on: 06/07/1988
Inventor: Hine

Method and apparatus for transferring wafers between cassettes and a boat
Patent #: 4770590
Issued on: 09/13/1988
Inventor: Hugues ,   et al.

Wafer alignment and transport mechanism
Patent #: 4892455
Issued on: 01/09/1990
Inventor: Hine

Method for transporting silicon wafers
Patent #: 5102291
Issued on: 04/07/1992
Inventor: Hine

Transport apparatus for semiconductor wafers
Patent #: 5803979
Issued on: 09/08/1998
Inventor: Hine, et al.

Apparatus for transferring a wafer
Patent #: 5810935
Issued on: 09/22/1998
Inventor: Lee, et al.

Wafer holder with spindle assembly and wafer holder actuator
Patent #: 5851041
Issued on: 12/22/1998
Inventor: Anderson, et al.

Substrate processing apparatus
Patent #: 6012192
Issued on: 01/11/2000
Inventor: Sawada, et al.

Robot arm with specimen edge gripping end effector
Patent #: 6256555
Issued on: 07/03/2001
Inventor: Bacchi, et al.

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Inventor

Assignee

Application

No. 609342 filed on 07/05/2000

US Classes:

414/757, Article frictionally engaged and rotated by relatively movable means (e.g., disc, endless belt, etc.)414/783, Orienter has article gripping means414/936, Including wafer orienting means414/941Includes means for gripping wafer

Examiners

Primary: Krizek, Janice L.

Attorney, Agent or Firm

Foreign Patent References

  • 1-120032 JP 05/18/1989

International Class

B65G 049/07

Abstract

An apparatus for holding and orienting a wafer having an alignment feature, and including a movable robot arm; and an end effector attached to an end of the robot arm, the end effector including a gripping mechanism which during operation both holds the wafer and rotates it about an axis that is perpendicular to the plane of the wafer and a sensing element for detecting the alignment feature on the wafer as the gripping mechanism rotates the wafer past the sensing element.

Other References

  • Kensington Wafer Handler Described in Material of Kensington Laboratories Inc., Richmond, CA, 198
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