Ultra-thin flexible durable radio frequency identification devices and hot or cold lamination process for the manufacture of ultra-thin flexible durable radio frequency identification devices
June 29, 2020. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent ReferencesMethod of producing personalized badges and the like Identification card with an IC-module and method for producing it Method of manufacturing an electronic identification card Data carrier having an integrated circuit and method for producing same Personal memory card having a contactless interface using differential data transfer IC card IC card and method of manufacturing the same Flexible printed circuit IC package and IC card incorporating the same thereinto Electronic microcircuit card and method for its manufacture InventorAssigneeApplicationNo. 606945 filed on 06/29/2000US Classes:340/572.1, Detectable device on protected article (e.g., "tag")156/298, Embedding of laminae within face of additional laminae156/312Sequential different pressure applyingExaminersPrimary: La, AnhAttorney, Agent or FirmInternational ClassG08B 013/14AbstractA ultra-thin flexible durable radio frequency plastic of other substrate identification device, such as cards, tags, badges, bracelets and labels including at least one electronic element embedded therein and a hot or cold lamination process for the manufacture of radio frequency identification devices including a micro IC chip embedded therein. The process results in a device having an overall thickness in the range of 0.005 inches to 0.033 inches with a surface suitable for receiving dye sublimation printing--the variation in the device thickness across the surface is less than 0.0005 inches. The hot lamination process of the present invention results in an aesthetically pleasing device which can be used as a sticker when adhesive is applied to the device. The invention also relates to a plastic device in all shapes and sizes formed in accordance with the hot lamination process of the present invention and can withstand harsh chemicals and various pressures.Other References
Field of SearchDetectable device on protected article (e.g., "tag")Specified processing arrangement for detected signal Specified relationship between field and detection frequencies (e.g., nth order harmonics) With covering of discrete laminae with additional lamina Sequential different pressure applying Embedding of laminae within face of additional laminae Sequential heating and cooling during pressure applying | |
