Method and apparatus for optimal wafer-by-wafer processing
October 7, 2019. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent ReferencesMethod for controlling semiconductor wafer processing Method for manufacturing semiconductor device Controlling process modules using site models and monitor wafer control Method and apparatus for monitoring processes using multiple parameters of a semiconductor wafer processing system Method for controlling a semiconductor manufacturing process by failure analysis feedback Intelligent usage of first pass defect data for improved statistical accuracy of wafer level classification Method for feedforward corrections for off-specification conditions Distributed control system for a semiconductor wafer processing machine Patent #: 6292708 InventorAssigneeApplicationNo. 414107 filed on 10/07/1999US Classes:700/121, Integrated circuit production or semiconductor fabrication438/5, INCLUDING CONTROL RESPONSIVE TO SENSED CONDITION700/45, Combined with feedback700/108Performance monitoringExaminersPrimary: Picard, Leo P.Assistant: Frank, Elliot Attorney, Agent or FirmInternational ClassesG06F 019/00G06F 013/02 H01L 021/00 AbstractThe present invention provides for a method and an apparatus for optimal wafer-by-wafer processing. Semiconductor devices are identified for wafer-by-wafer analysis. At least one value of a controlled variable in the wafer-by-wafer analysis is identified. A trajectory of recipes is created for the identified semiconductor devices. A feedback implementation of wafer-by-wafer control is performed using the trajectory of recipes upon the identified semiconductor devices. A feed-forward implementation of wafer-by-wafer control is performed using the trajectory of recipes upon the identified semiconductor devices.Field of SearchFeed-forward (e.g., predictive)Combined with feedback Performance monitoring Quality control Defect analysis or recognition Integrated circuit production or semiconductor fabrication Performance monitoring Positional compensation or modification compensation or mod INCLUDING CONTROL RESPONSIVE TO SENSED CONDITION WITH MEASURING OR TESTING | |
