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Flash memory with ultra thin vertical body transistors

Patent 6424001 Issued on July 23, 2002. Estimated Expiration Date: Icon_subject February 9, 2021. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.

Patent References

High density flash memory
Patent #: 5936274
Issued on: 08/10/1999
Inventor: Forbes, et al.

Ultra high density flash memory having vertically stacked devices
Patent #: 5973352
Issued on: 10/26/1999
Inventor: Noble

Ultra high density flash memory
Patent #: 5973356
Issued on: 10/26/1999
Inventor: Noble, et al.

Programmable memory address decode array with vertical transistors
Patent #: 5991225
Issued on: 11/23/1999
Inventor: Forbes, et al.

Four F2 folded bit line DRAM cell structure having buried bit and word lines
Patent #: 6072209
Issued on: 06/06/2000
Inventor: Noble, et al.

Field programmable logic arrays with vertical transistors
Patent #: 6124729
Issued on: 09/26/2000
Inventor: Noble, et al.

High density flash memory
Patent #: 6143636
Issued on: 11/07/2000
Inventor: Forbes, et al.

Memory cell having a vertical transistor with buried source/drain and dual gates
Patent #: 6150687
Issued on: 11/21/2000
Inventor: Noble, et al.

Method of forming a logic array for a decoder
Patent #: 6153468
Issued on: 11/28/2000
Inventor: Forbes, et al.

Method for forming high density flash memory Patent #: 6238976
Issued on: 05/29/2001
Inventor: Noble ,   et al.

Inventors

Application

No. 780169 filed on 02/09/2001

US Classes:

257/315, With floating gate electrode257/353, Single crystal islands of semiconductor layer containing only one active device257/E29.129, Gate electrodes for transistors with floating gate (EPO)257/E29.302Hi-lo programming levels only (EPO)

Examiners

Primary: Weiss, Howard

Attorney, Agent or Firm

International Classes

H01L 029/788
H01L 027/01
H01L 027/12
H01L 031/039.2

Abstract

Structures and method for Flash memory with ultra thin vertical body transistors are provided. The Flash memory includes an array of memory cells including floating gate transistors. Each floating gate transistor includes a pillar extending outwardly from a semiconductor substrate. The pillar includes a single crystalline first contact layer and a second contact layer vertically separated by an oxide layer. A single crystalline vertical transistor is formed along side of the pillar. The single crystalline vertical transistor includes an ultra thin single crystalline vertical body region which separates an ultra thin single crystalline vertical first source/drain region and an ultra thin single crystalline vertical second source/drain region. A floating gate opposes the ultra thin single crystalline vertical body region, and a control gate separated from the floating gate by an insulator layer.

Other References

  • Hergenrother, J.M., "The Vertical Replacement-Gate (VRG) MOSFET: A 50nm Vertical MOSFET with Lithography-Independent Gate Length", IEEE, pp. 75-78, (1999)
  • Kalavade, P., et al., "A Novel sub-10nm Transistor", IEEE Device Research Conference, Denver, Co., pp. 71-72, (2000)
  • Xuan, P., et al., "60nm Planarized Ultra-thin Body Solid Phase Epitaxy MOSFETs", IEEE Device Research Conference, Denver, CO, pp. 67-68, (2000
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