Jig used for assembling semiconductor devices
December 9, 2017. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent References 2730370 Distortion free 3 point vacuum fixture Self-compensating hydrostatic flattening of semiconductor substrates Packaging system for multiple semiconductor devices Method using a multiple device vacuum chuck for an automatic microelectronic bonding apparatus Substrate transport and cooling apparatus and method for same Etching apparatus Semiconductor device package with dies mounted on both sides of the central pad of a metal frame Method for fabricating a multichip semiconductor device having two interdigitated leadframes Semiconductor device package and method of making such a package InventorsApplicationNo. 987054 filed on 12/09/1997US Classes:29/25.01, BARRIER LAYER OR SEMICONDUCTOR DEVICE MAKING269/21, Vacuum-type holding means277/910O-RING SEALExaminersPrimary: Graybill, David E.Foreign Patent References
International ClassesH01L 021/00H01L 021/64 B25B 011/00 Foreign Application Priority Data1994-11-30 JPAbstractA jig used for assembling semiconductor devices has an arrangement wherein the first semiconductor integrated circuit chip, which is die-bonded and wire-bonded onto one surface of a lead frame, is fitted to the inner section of a support stage and is supported by an elastic member that is designed to be higher than the inner section, while the lead frame is supported by the outer section of the support stage. In this state, the second semiconductor integrated circuit chip is die-bonded onto the other surface of the lead frame by applying pressure by means of a bonding collet. Thus, it becomes possible to prevent cracks that may be caused in a passivation film and also to improve the reliability and the final yield of semiconductor devices. | |
