Electronic package having embedded capacitors and method of fabrication therefor
June 29, 2020. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent ReferencesCapacitive chip carrier and multilayer ceramic capacitors MMC Substrate including capacitors having perovskite structure dielectric and electrical devices including MMC substrate Shrinkage-matched circuit package utilizing low temperature co-fired ceramic structures Flexible interconnect film including resistor and capacitor layers Semiconductor package substrate with power die Multi-layer ceramic substrate and method for producing the same Patent #: 6153290 InventorsApplicationNo. 606882 filed on 06/29/2000US Classes:361/763, Capacitor and electrical component29/832, Assembling to base an electrical component, e.g., capacitor, etc.257/724, With discrete components257/E23.062, Multilayer substrates (EPO)257/E23.079, For integrated circuit devices, e.g., power bus, number of leads (EPO)361/306.2, For decoupling type capacitor361/760, Connection of components to board361/761, Component within printed circuit board361/782, Having passive component361/793Thick film component or materialExaminersPrimary: Cuneo, KamandAssistant: Vigushin, John B. Attorney, Agent or FirmInternational ClassH05K 001/18AbstractAn electronic package (302, FIG. 3) includes one or more capacitors (308) embedded within one or more layers (310) of the package. The embedded capacitors are discrete devices, such as integrated circuit capacitors (FIGS. 17-18) or ceramic capacitors. During the package build-up process, the capacitors are mounted (410, FIG. 4) to a package layer, and a non-conductive layer is applied (412) over the capacitors. When the build-up process is completed, the capacitor's terminals (604, 608, FIG. 6) are electrically connected to the top surface of the package. The embedded capacitor structure can be used in an integrated circuit package (1904, FIG. 19), an interposer (1906), and/or a printed circuit board (1908).Other References
Field of SearchFor decoupling type capacitorWith coupling or decoupling capacitor With resistor and capacitor Component within printed circuit board With specific dielectric material or layer Capacitor and electrical component Integrated circuit Different voltage layers Having passive component Plural contiguous boards Thick film component or material Power, voltage, or current layer Plural dielectric layers Connection of components to board With particular substrate or support structure With electrical device Having power distribution means (e.g., bus structure) Multiple contact layers separated from each other by insulator means and forming part of a package or housing (e.g., plural ceramic layer package) Insulating material Of insulating material other than ceramic Composite ceramic, or single ceramic with metal For plural devices With discrete components For high frequency (e.g., microwave) device Semiconductor mounts Assembling to base an electrical component, e.g., capacitor, etc. | |
