Patent References 732119 839356 3534510 3585764 Method for cutting ornamental transparent gemstones and products produced therefrom Process for cutting a diamond to provide an invisible mounting Diamond sawing process Method of facetting a gem Patent #: 5462474 InventorApplicationNo. 706715 filed on 11/07/2000US Classes:125/30.01, PRECIOUS STONE WORKING63/32, GEM125/39, Diamond451/41Glass or stone abradingExaminersPrimary: Nguyen, GeorgeAttorney, Agent or FirmForeign Patent References
International ClassB28D 005/00AbstractDisclosed are a new diamond cutting method and a diamond shape or proportion giving an increased brightness and different brilliant colors to the cut jewel. A piece of diamond having a crown or bezel and a pavilion converging up and down from its girdle is prepared; the table of the crown is cut into a regular polygon having straight sides of an integer multiple of three; star facets, upper-main facets and paired upper-girdle facets are formed on the oblique annular surface between the polygonal table and the girdle; and lower-girdle facets and lower-main facets are cut on the pavilion. The height of the diamond piece is approximately 64% of the diameter of the girdle; the height of the crown is approximately 15.7%; the height of the pavilion is approximately 48.3%; and the largest width of the girdle is approximately 1.2 to 1.4%. The angle formed between the ridge of the crown and the ridge of the pavilion is approximately 77 degrees. | |