U.S. patents available from 1976 to present.
U.S. patent applications available from 2005 to present.

Self-adhesive composition

Patent 6388006 Issued on May 14, 2002. Estimated Expiration Date: Icon_subject May 22, 2020. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.

Patent References

Pressure-sensitive adhesive based on ethylenically-unsaturated ଱-olefin polymer cured with hydrosilane
Patent #: 5194501
Issued on: 03/16/1993
Inventor: Babu, et al.

Curable resin composition
Patent #: 5733978
Issued on: 03/31/1998
Inventor: Kobayashi

(Co)polymers and a novel polymerization process based on atom (or group) transfer radical polymerization
Patent #: 5763548
Issued on: 06/09/1998
Inventor: Matyjaszewski, et al.

Curable silicone compositions
Patent #: 5789485
Issued on: 08/04/1998
Inventor: Kobayashi, et al.

Preparation of novel homo- and copolymers using atom transfer radical polymerization
Patent #: 5789487
Issued on: 08/04/1998
Inventor: Matyjaszewski, et al.

Processes based on atom (or group) transfer radical polymerization and novel (co) polymers having useful structures and properties Patent #: 5807937
Issued on: 09/15/1998
Inventor: Matyjaszewski, et al.

Inventors

Assignee

Application

No. 485119 filed on 05/22/2000

US Classes:

524/862, With ethylenically unsaturated reactant156/327, Synthetic resin containing156/329, Silicon resin524/849, Solid polymer from ethylenic monomer only, said polymer formed in the presence of a nonreactant material524/853Carboxylic acid or derivative monomer

Examiners

Primary: Nutter, Nathan M.

Attorney, Agent or Firm

Foreign Patent References

  • WO 96/30421 WO. 10/13/1996
  • WO 97/18247 WO. 05/13/1997

International Classes

C09J 001/00
C08F 002/00
C08F 008/100
C08F 010/00
C08L 001/00

Foreign Application Priority Data

1997-08-06 JP

Abstract

A pressure sensitive adhesive composition which comprises the following two components:(A) a vinyl polymer having at least one alkenyl group represented by the general formula (1):CH2=C(R1)-- (1)wherein R1 represents a hydrogen atom or a methyl group;(B) a hydrosilyl group-containing compound is provided. The composition can give cured products having a high gel fraction and can be cured rapidly since the degree of alkenyl group introduction is high.

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