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Apparatus for wire bonding
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Issued on: 11/30/1982
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Lead frame wire bonding by preheating
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Wire bonding apparatus
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Bonding tool and clamp assembly and wire handling method
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Wire bonding apparatus
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Voice coil actuated fine wire clamp
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Quick change work station apparatus for automatic wire bonders
Patent #: 4765531
Issued on: 08/23/1988
Inventor: Ricketson , et al.
Ultrasonic wire bonding tool
Patent #: 4778097
Issued on: 10/18/1988
Inventor: Hauser
Single lead automatic clamping and bonding system
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Hold-down clamp with mult-fingered interchangeable insert for wire bonding semiconductor lead frames
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Inventor: Cotney
Metal electronic package having improved resistance to electromagnetic interference
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Issued on: 08/27/1991
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Method of manufacturing a leadframe having conductive elements preformed with solder bumps
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Issued on: 11/19/1991
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Voice coil programmable wire tensioner
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Issued on: 05/19/1992
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Wedge bonding tool
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Issued on: 09/22/1992
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Semiconductor device package and method of making such a package
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Wire bonding method and apparatus with lead pressing means
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Inventor: Yamazaki
Semiconductor bonding tool
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Integrated circuit die-to-leadframe interconnect assembly system
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Smart indexing head for universal lead frame work station
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Method and apparatus for wire bonding semiconductor dice to a leadframe
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Method for forming plastic molded package with heat sink for integrated circuit devices
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Issued on: 07/12/1994
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Method for molding a semiconductor package on a continuous leadframe
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Method for constructing a dual sided, wire bonded integrated circuit chip package
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Silver spot/palladium plate lead frame finish
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Fine pitch capillary bonding tool
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Bonding tool, production and handling thereof
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Wedge wire bonding tool tip
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Issued on: 08/29/1995
Inventor: Huddleston
Method and apparatus for fine pitch wire bonding using a shaved capillary
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Lead frame clamp for ultrasonic bonding
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Inventor: Asanasavest
Bondhead lead clamp apparatus and method
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High conductivity interconnection line
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Inventor: Wollesen
Method for mounting a microelectronic circuit peripherally-leaded package including integral support member with spacer
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Method for testing semiconductor dice with conventionally sized temporary packages
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Direct contact die attach
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Apparatus and method of clamping semiconductor devices using sliding finger supports
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Issued on: 04/06/1999
Inventor: Ball
Dambarless leadframe for molded component encapsulation
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Support member for mounting a microelectronic circuit package
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Dambarless leadframe for molded component encapsulation
Patent #: 5949132
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Lead finger clamp assembly
Patent #: 5954842
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Inventor: Fogal, et al.
Wire bonding methods and apparatus for heat sensitive metallization using a thermally insulated support portion
Patent #: 6031216
Issued on: 02/29/2000
Inventor: Singh, et al.
Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuits
Patent #: 6105846
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Inventor: Evers, et al.
Die paddle clamping method for wire bond enhancement
Patent #: 6121674
Issued on: 09/19/2000
Inventor: Corisis
Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuits
Patent #: 6138891
Issued on: 10/31/2000
Inventor: Evers, et al.
Die paddle clamping method for wire bond enhancement Patent #: 6162662
Issued on: 12/19/2000
Inventor: Corisis
October 3, 2020. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
