Method for enabling conventional wire bonding to copper-based bond pad features
March 31, 2019. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent ReferencesComposition and method for acid cleaning of aluminum surfaces Etching solutions containing ammonium fluoride and anionic sulfate esters of alkylphenol polyglycidol ethers and method of etching Slurries and methods for chemical mechanical polish of aluminum and titanium aluminide Method for CMP cleaning improvement Procedure for the drying of silicon Containment apparatus Apparatus for a brush assembly Metal brightening composition and process that do not damage glass Method and apparatus for cleaning of semiconductor substrates using standard clean 1 (SC1) Method and apparatus for cleaning of semiconductor substrates using hydrofluoric acid (HF) InventorsAssigneeApplicationNo. 282596 filed on 03/31/1999US Classes:438/687, Copper of copper alloy conductor257/E21.251, By chemical means (EPO)257/E21.309, By liquid etching only (EPO)257/E21.508, Forming solder bumps (EPO)257/E21.518, Involving application of mechanical vibration, e.g., ultrasonic vibration (EPO)438/692, Simultaneous (e.g., chemical-mechanical polishing, etc.)438/693, Utilizing particulate abradant438/745, Liquid phase etching438/747, With relative movement between substrate and confined pool of etchant438/754Electrically conductive material (e.g., metal, conductive oxide, etc.)ExaminersPrimary: Nelms, David C.Assistant: Berry, Renee R. Attorney, Agent or FirmForeign Patent References
International ClassH01L 021/44AbstractA method is described comprising removing an oxide from a surface and then commencing application of a passivation layer to the surface within 5 seconds of the oxide removal. The surface may be a copper surface which may further comprise a bonding pad surface. Removing the oxide may further comprise applying a solution comprising citric acid or hydrochloric acid. Applying the passivation layer may further comprise applying a solution comprising a member of the azole family where the azole family member may further comprise BTA. The method may also further comprise completely applying the passivation layer 35 seconds after commencing its application.Other References
Field of SearchCopper of copper alloy conductorSimultaneous (e.g., chemical-mechanical polishing, etc.) Utilizing particulate abradant Liquid phase etching With relative movement between substrate and confined pool of etchant Electrically conductive material (e.g., metal, conductive oxide, etc.) PLANARIZING A NONPLANAR SURFACE With measuring, testing, or inspecting | |
