Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus
Method and apparatus for detecting a polishing endpoint based upon heat conducted through a semiconductor wafer
Film inspection method
Method and apparatus for in-situ end-point detection and optimization of a chemical-mechanical polishing process using a linear polisher
Endpoint detection with light beams of different wavelengths
Apparatus for in-situ optical endpointing on web-format planarizing machines in mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies and methods for making and using same Patent #: 6213845
ApplicationNo. 671774 filed on 09/28/2000
US Classes:451/285, Rotary work holder451/527, Interrupted or composite work face (e.g., cracked, nonplanar, etc.)451/529, Sectional451/530Work face variegated or on projecting backing
ExaminersPrimary: Morgan, Eileen P.
Attorney, Agent or Firm
Foreign Patent References
International ClassB24B 029/00
AbstractA polishing pad for use with a polishing fluid has, a polishing layer, a window in an opening through the polishing layer, and a fluid impermeable layer spanning across the polishing layer and the window and the opening to provide an uninterrupted continuous barrier to leakage of polishing fluid, the fluid impermeable layer having thereon an adhesive forming bond seals with the polishing layer and the window.