Polishing pad
September 28, 2020. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent ReferencesForming a transparent window in a polishing pad for a chemical mechanical polishing apparatus Method and apparatus for detecting a polishing endpoint based upon heat conducted through a semiconductor wafer Film inspection method Method and apparatus for in-situ end-point detection and optimization of a chemical-mechanical polishing process using a linear polisher Endpoint detection with light beams of different wavelengths Apparatus for in-situ optical endpointing on web-format planarizing machines in mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies and methods for making and using same Patent #: 6213845 InventorsAssigneeApplicationNo. 671774 filed on 09/28/2000US Classes:451/285, Rotary work holder451/527, Interrupted or composite work face (e.g., cracked, nonplanar, etc.)451/529, Sectional451/530Work face variegated or on projecting backingExaminersPrimary: Morgan, Eileen P.Attorney, Agent or FirmForeign Patent References
International ClassB24B 029/00AbstractA polishing pad for use with a polishing fluid has, a polishing layer, a window in an opening through the polishing layer, and a fluid impermeable layer spanning across the polishing layer and the window and the opening to provide an uninterrupted continuous barrier to leakage of polishing fluid, the fluid impermeable layer having thereon an adhesive forming bond seals with the polishing layer and the window. | |
