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US Patent 6347521 - Temperature control device and method for manufacturing the same

US Patent Issued on February 19, 2002
Estimated Patent Expiration Date: Icon_subject October 11, 2020Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
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Abstract

The invention provides a temperature control device with excellent temperature uniformity and thermal response, which can be manufactured easily, and a manufacturing method for the same. A thermoelectric device 21 is arranged between a substrate mounting plate 1 and a cooling plate 3. Copper foil electrodes 5, 5, . . . on the upper side of the thermoelectric device 21 are adhered to a lower surface of the substrate mounting plate 1 with an adhesive sheet 17 covering substantially the entire lower surface of the substrate mounting plate 1, and copper foil electrodes 7, 7, . . . on the lower side of the thermoelectric device 21 are adhered to an upper surface of the cooling plate 3 with an adhesive sheet 19 covering substantially the entire upper surface of the substrate mounting plate 1. The total thickness of the adhesive sheet 17 and the copper foil electrodes 5 adhering to it, and the total thickness of the adhesive sheet 19 and the copper foil electrodes 7 adhering to it, is each set approximately 25 to 1000 μm thin, so as to make the thermal resistance sufficiently low. Thermoelectric conversion elements 9 and 13 are distributed across a large area covering at least the entire area corresponding to the substrate 2.

Inventors

Application

No. 685805 filed on 10/11/2000

US Classes:

62/3.7, Including specific circuitry or heat exchanger material136/204, Including additional heat exchange means257/E23.082Cooling arrangements using Peltier effect (EPO)

Field of Search

62/3.2, Thermoelectric; e.g., peltier effect62/3.3, Heat pump, selective heating and cooling62/3.7, Including specific circuitry or heat exchanger material136/203, Peltier effect device136/204, Including additional heat exchange means136/225Having strip, film or plate-type thermocouples

Examiners

Primary: Doerrler, William C.

Attorney, Agent or Firm

US Patent References

4420364, High-insulation multi-layer device formed on a metal substrate
Issued on: 12/13/1983
Inventor: Nukii ,   et al.
4735847, Electrically conductive adhesive sheet, circuit board and electrical connection structure using the same
Issued on: 04/05/1988
Inventor: Fujiwara ,   et al.
5588300, Thermoelectric refrigeration system with flexible heatconducting element
Issued on: 12/31/1996
Inventor: Larsson, et al.
5605048, Method of cooling an object with a thermoelectric battery cascade
Issued on: 02/25/1997
Inventor: Kozlov, et al.
5737923, Thermoelectric device with evaporating/condensing heat exchanger
Issued on: 04/14/1998
Inventor: Gilley, et al.
5802856, Multizone bake/chill thermal cycling module
Issued on: 09/08/1998
Inventor: Schaper, et al.
5956569, Integrated thermoelectric cooler formed on the backside of a substrate
Issued on: 09/21/1999
Inventor: Shiu, et al.
6000225, Two dimensional thermoelectric cooler configuration
Issued on: 12/14/1999
Inventor: Ghoshal
6096965Quantum well thermoelectric material on organic substrate
Issued on: 08/01/2000
Inventor: Ghamaty, et al.

International Classes

F25B 021/02
H01L 035/28

Foreign Application Priority Data

1999-10-13 JP

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