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Temperature control device and method for manufacturing the same

Patent 6347521 Issued on February 19, 2002. Estimated Expiration Date: Icon_subject October 11, 2020. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.

Patent References

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Inventors

Application

No. 685805 filed on 10/11/2000

US Classes:

62/3.7, Including specific circuitry or heat exchanger material136/204, Including additional heat exchange means257/E23.082Cooling arrangements using Peltier effect (EPO)

Examiners

Primary: Doerrler, William C.

Attorney, Agent or Firm

International Classes

F25B 021/02
H01L 035/28

Foreign Application Priority Data

1999-10-13 JP

Abstract

The invention provides a temperature control device with excellent temperature uniformity and thermal response, which can be manufactured easily, and a manufacturing method for the same. A thermoelectric device 21 is arranged between a substrate mounting plate 1 and a cooling plate 3. Copper foil electrodes 5, 5, . . . on the upper side of the thermoelectric device 21 are adhered to a lower surface of the substrate mounting plate 1 with an adhesive sheet 17 covering substantially the entire lower surface of the substrate mounting plate 1, and copper foil electrodes 7, 7, . . . on the lower side of the thermoelectric device 21 are adhered to an upper surface of the cooling plate 3 with an adhesive sheet 19 covering substantially the entire upper surface of the substrate mounting plate 1. The total thickness of the adhesive sheet 17 and the copper foil electrodes 5 adhering to it, and the total thickness of the adhesive sheet 19 and the copper foil electrodes 7 adhering to it, is each set approximately 25 to 1000 μm thin, so as to make the thermal resistance sufficiently low. Thermoelectric conversion elements 9 and 13 are distributed across a large area covering at least the entire area corresponding to the substrate 2.

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