Temperature control device and method for manufacturing the same
October 11, 2020. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent ReferencesHigh-insulation multi-layer device formed on a metal substrate Electrically conductive adhesive sheet, circuit board and electrical connection structure using the same Thermoelectric refrigeration system with flexible heatconducting element Method of cooling an object with a thermoelectric battery cascade Thermoelectric device with evaporating/condensing heat exchanger Multizone bake/chill thermal cycling module Integrated thermoelectric cooler formed on the backside of a substrate Two dimensional thermoelectric cooler configuration Quantum well thermoelectric material on organic substrate Patent #: 6096965 InventorsApplicationNo. 685805 filed on 10/11/2000US Classes:62/3.7, Including specific circuitry or heat exchanger material136/204, Including additional heat exchange means257/E23.082Cooling arrangements using Peltier effect (EPO)ExaminersPrimary: Doerrler, William C.Attorney, Agent or FirmInternational ClassesF25B 021/02H01L 035/28 Foreign Application Priority Data1999-10-13 JPAbstractThe invention provides a temperature control device with excellent temperature uniformity and thermal response, which can be manufactured easily, and a manufacturing method for the same. A thermoelectric device 21 is arranged between a substrate mounting plate 1 and a cooling plate 3. Copper foil electrodes 5, 5, . . . on the upper side of the thermoelectric device 21 are adhered to a lower surface of the substrate mounting plate 1 with an adhesive sheet 17 covering substantially the entire lower surface of the substrate mounting plate 1, and copper foil electrodes 7, 7, . . . on the lower side of the thermoelectric device 21 are adhered to an upper surface of the cooling plate 3 with an adhesive sheet 19 covering substantially the entire upper surface of the substrate mounting plate 1. The total thickness of the adhesive sheet 17 and the copper foil electrodes 5 adhering to it, and the total thickness of the adhesive sheet 19 and the copper foil electrodes 7 adhering to it, is each set approximately 25 to 1000 μm thin, so as to make the thermal resistance sufficiently low. Thermoelectric conversion elements 9 and 13 are distributed across a large area covering at least the entire area corresponding to the substrate 2. | |
