Composite connection structure and method of manufacturing
Patent 6337445 Issued on January 8, 2002. Estimated Expiration Date: 
March 12, 2019. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
March 12, 2019. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent ReferencesComposite bump flip chip bonding Socketable bump grid array shaped-solder on copper spheres Method and apparatus for flexibly connecting electronic devices Patent #: 5956235 InventorsAssigneeApplicationNo. 270184 filed on 03/12/1999US Classes:174/260, With electrical device174/257, Conducting (e.g., ink)228/180.22, Lead-less (or "bumped") device257/E23.069, Spherical bumps on substrate for external connection, e.g., ball grid arrays (BGA) (EPO)361/768Having leadless componentExaminersPrimary: Cuneo, KamandAttorney, Agent or FirmInternational ClassesH05K 001/16H05K 007/10 AbstractA bump connection structure and a method of attachment to integrated circuits or packages is provided which comprises a prefabricated core structure coated with solderable metal layers to form a composite bump. Said composite bump is aligned to contact pads of the chip or package which have been coated with solder paste, and the assembly heated to form a metallurgical bond. The prefabricated core structures are comprised of metal, plastic or ceramic of the size and dictated by package standards. The connection structure is preferably lead free. | |
