Thermoelectric-cooling temperature control apparatus for semiconductor device fabrication facility
February 23, 2020. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent ReferencesApparatus for cooling circuits Thermoelectric conversion module with series connection Thermoelectric heat pump Multistage thermoelectric cooling device Thermoelectric module and method of manufacturing the same Monitoring system for semiconductor device fabrication facility Electrically-isolated ultra-thin substrates for thermoelectric coolers Patent #: 6222113 InventorsApplicationNo. 511896 filed on 02/23/2000US Classes:62/3.2, Thermoelectric; e.g., peltier effect62/3.7Including specific circuitry or heat exchanger materialExaminersPrimary: Bennett, HenryAssistant: Jones, Melvin Attorney, Agent or FirmForeign Patent References
International ClassF25B 021/02Foreign Application Priority Data1999-03-05 KRAbstractA thermoelectric-cooling temperature control apparatus for a semiconductor device fabrication facility maintains a temperature condition, such as the temperature of a wafer, stable during the fabrication process. The apparatus includes a heat exchanger having a thermoelectric cooling element which produces a Peltier Effect to cause the element to absorb and radiate heat according to current flowing through the element | |
