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Heat sink casing for circuit board components
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Issued on: 01/20/1976
Inventor: Horbach
Chassis device having vented base and radiation member for supporting heat sources
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Issued on: 02/24/1976
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Island assembly employing cooling means for high density integrated circuit packaging
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D-I-P On island
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Cooling system for dual-in-line packages
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Combination heat sink for a semiconductor
Patent #: 4471407
Issued on: 09/11/1984
Inventor: Sleder
Repeater housing and circuit mounting structure
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Issued on: 07/09/1985
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Immersion cooled high density electronic assembly
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Cooled stack of electrically isolated semiconductors
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Power supply
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Issued on: 01/27/1987
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Evaporation cooling module for semiconductor devices
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Cooling accessory attachable to an electronic instrument
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Chip on board package for integrated circuit devices using printed circuit boards and means for conveying the heat to the opposite side of the package from the chip mounting side to permit the heat to dissipate therefrom
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Issued on: 03/01/1988
Inventor: Brown
High density multi-chip interconnection and cooling package
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Issued on: 05/31/1988
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Ventilation system
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Fluid-cooled integrated circuit package
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Integrated circuit chips cooling module having coolant leakage prevention device
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D.C. to A.C. inverter having improved structure providing improved thermal dissipation
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Issued on: 06/23/1992
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Disk drive cooling system bracket
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Cooling abnormality detection system for electronic equipment
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Thermal packaging for natural convection cooled electronics
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Pulsatile impinging cooling system for electronic IC modules and systems using fluidic oscillators
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Arrangement for cooling electronic equipment by radiation transfer
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Masking of circuit board vias to reduce heat-induced board and chip carrier package warp during wavesolder process
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Patent #: 5826547
Issued on: 10/27/1998
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Computer hard drive heat sink assembly Patent #: 5927386
Issued on: 07/27/1999
Inventor: Lin
February 17, 2018. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
