Cover structure for a wireless communication device and method in its manufacture as well as a wireless communication device
September 22, 2018. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent ReferencesMagnetic bubble memory device cassette Method of mounting a printed circuit board and securing the earthing to a casing Multifunctional card having a static protection Plastic shell structure for radio telephone Procedure for manufacturing a radio telephone chassis and a chassis manufactured according to this procedure Data card perimeter shield Memory card and frame for assembly therefor Rigidized outer support structure for an integrated circuit card Sonically-bonded outer support structure for an integrated circuit card One-piece housing and interlocking connector for IC card assemblies InventorsAssigneeApplicationNo. 158692 filed on 09/22/1998US Classes:361/737, IC card or card member211/41.17, Circuit board361/753, Specific chassis or ground361/800, With Shielding Structure361/818EMIExaminersPrimary: Gandhi, Jayprakash N.Attorney, Agent or FirmInternational ClassesH05K 005/02H05K 009/00 G06F 001/16 Foreign Application Priority Data1997-09-23 FIAbstractThe present invention relates to a cover structure for a wireless communication device arranged at least partly as a standard expansion card, and the cover structure (3) being provided with at least one cover surface (3a, 3b). The cover surface (3a, 3b) is provided with at least one elongated bracing groove (G1 to G3) for increasing the dimensional stability of the cover surface (3a, 3b, 4a, 4b, 4c). In an advantageous embodiment of the cover structure (3), the thickness of the cover structure (3) at the bracing groove corresponds substantially to the thickness of the cover structure (3) at the cover surface (3a, 3b), and the bracing groove (G1 to G3) extends substantially over the cover surface (3a, 3b) and the depth of the bracing groove (G1 to G3) is smaller than the thickness of the cover structure (3) at the cover surface (3a, 3b). The present invention relates also to a method in the manufacture of the cover structure for a wireless communication device. The present invention relates further to a wireless communication device which is arranged at least partly as a standard expansion card and comprises at least one cover structure (3) provided with at least one cover surface (3a, 3b). In an advantageous embodiment of the wireless communication device, the bracing groove (G1 to G3) is arranged transverse to the longitudinal axis of the wireless communication device.Field of SearchWith printed circuit boardsIC card or card member With housing or chassis Specific chassis or ground Specific latching or retaining device Specific alignment or guide means EMI With Shielding Structure MEMORY CARD CARTRIDGE Conductive Smart (e.g., credit) card package Circuit board For a circuit board Including electrical field, magnetic field, or static electricity shielding | |
