Patent References 3523706 3539216 3627590 Tool for the contact-free support of discs Contactless air film lifting device Method and apparatus for microwave heat-treatment of a semiconductor water Plasma processor and method for IC fabrication Wafer handler Non-contact pick-up head Wafer handling system with bernoulli pick-up InventorAssigneeApplicationNo. 361037 filed on 07/23/1999US Classes:294/64.3, By positive fluid stream directed against article414/941Includes means for gripping waferExaminersPrimary: Kramer, Dean J.Attorney, Agent or FirmInternational ClassesB25J 015/06B65G 049/07 AbstractA device that supports a substrate in a non-containing manner so as to controllably move the substrate within a substrate processing system. The device includes an end effector carrying support pads each having a vertical gas outlet and a horizontal outlet communicating with a gas supply to form a plurality of vertical gas jets and a plurality of horizontal gas jets. The vertical gas jets impinge on a lower surface of the substrate to urge the substrate into a fixed vertical position with respect to the support pads and the horizontal gas jets impinge on the substrate edge to urge the substrate into a fixed horizontal position with respect to the pads.Other References
| |