Structure, materials, and applications of ball grid array interconnections

Patent 6297559 Issued on October 2, 2001. Estimated Expiration Date:

June 30, 2018. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.

Abstract Claims Description Full Text

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Inventors

Application

No. 107998 filed on 06/30/1998

US Classes:

257/778, Flip chip228/180.22, Lead-less (or "bumped") device257/738, Ball shaped257/779, Solder wettable contact, lead, or bond257/780, Ball or nail head type contact, lead, or bond257/E23.069, Spherical bumps on substrate for external connection, e.g., ball grid arrays (BGA) (EPO)361/760, Connection of components to board361/768, Having leadless component361/779With specific connection material

Examiners

Primary: Chaudhuri, Olik
Assistant: Chambliss, Alonzo

Attorney, Agent or Firm

Connolly Bove Lodge & Hutz, Morris; Daniel P.

International Class

H01L 023/48

Abstract

A new interconnection scheme of a ball grid array (BGA) module is disclosed where a solder ball is connected to the BGA module by use of an electrically conducting adhesive The electrically conducting adhesive can be a mixture comprising a polymer resin, no-clean solder flux, a plurality of electrically conducting particles with an electrically conducting fusible coating and others. The solder balls in a BGA module can also be connected to a printed circuit board by use of another electrically conductive adhesive which can be joined at a lower temperature than the first joining to the BGA module. Additionally, an electrically conducting adhesive can be formed into electrically conducting adhesive bumps which interconnect an integrated circuit device to the BGA module.