Semiconductor chip package
Resin-sealed type semiconductor device
Semiconductor device, method of manufacturing the semiconductor device, and method of manufacturing lead frame
Method of fabricating a semiconductor package Patent #: 6146918
ApplicationNo. 455669 filed on 12/07/1999
US Classes:257/666, LEAD FRAME257/676With structure for mounting semiconductor chip to lead frame (e.g., configuration of die bonding flag, absence of a die bonding flag, recess for LED)
ExaminersPrimary: Chaudhuri, Olik
Assistant: Cao, Phat X.
Attorney, Agent or Firm
Foreign Patent References
International ClassH01L 023/495
Foreign Application Priority Data1998-12-16 KR
AbstractThe present invention discloses a chip scale package. According to this invention, a lead frame 130 is bonded with an adhesive 140 to a bottom face of a semiconductor chip 110. An inner lead 131 of the lead frame 130 is connected to a pad 111 of the semiconductor chip with a metal wire 120, and thickness of the inner lead 131 is equal to an original thickness of the lead frame 130. An outer lead 132 of the lead frame 130 is formed by partially etching a bottom face of the lead frame 130. The entire resultant is encapsulated with a molding compound 100 such that the outer lead 132 is exposed therefrom, especially there is formed a downward protruding portion 101 at the molding compound 100 in the lower inner lead portion 131. This protruding portion raises the margin controlling the bonding height during the wire-bonding process such that the metal wire 120 is not exposed from the molding compound 100. Furthermore, the outer leads 134 at both sides where no solder balls are mounted on, are exposed from the molding compound 100. The outer leads 132 at both sides being exposed from the molding compound 100 act for dissipating outwardly heat that is transmitted from the semiconductor chip 110 to the lead frame 130. A solder ball 150 is mounted at the inside of the outer lead 132 exposed from the molding compound 100.