U.S. patents available from 1976 to present.
U.S. patent applications available from 2005 to present.

Fruit chiller

Patent 6295820 Issued on October 2, 2001. Estimated Expiration Date: Icon_subject March 14, 2020. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.

Patent References

3040539

Compact thermoelectric refrigerator
Patent #: 4326383
Issued on: 04/27/1982
Inventor: Reed ,   et al.

Vehicle thermoelectric cooling and heating food and drink appliance
Patent #: 4823554
Issued on: 04/25/1989
Inventor: Trachtenberg ,   et al.

Drinking container
Patent #: 5042258
Issued on: 08/27/1991
Inventor: Sundhar

Portable refrigerating/heating apparatus
Patent #: 5111664
Issued on: 05/12/1992
Inventor: Yang

Compact thermoelectrically cooled beverage dispenser
Patent #: 5209069
Issued on: 05/11/1993
Inventor: Newnan

Portable refrigerator
Patent #: 5247798
Issued on: 09/28/1993
Inventor: Collard, Jr.

Modular thermoelectric assembly
Patent #: 5315830
Issued on: 05/31/1994
Inventor: Doke, et al.

Chilled service bowl
Patent #: 5423194
Issued on: 06/13/1995
Inventor: Senecal

Thermoelectric module
Patent #: 5448109
Issued on: 09/05/1995
Inventor: Cauchy

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Inventors

Assignee

Application

No. 525140 filed on 03/14/2000

US Classes:

62/3.6, Interior of enclosure cooled; e.g., refrigerator62/457.9Cooled by means other than ice (e.g., mechanical, electrical, absorption, cryogenic, etc.)

Examiners

Primary: Bennett, Henry
Assistant: Jiang, Chen-Wen

Attorney, Agent or Firm

Foreign Patent References

  • 4028658-A1 DE. 03/24/1991

International Class

F25B 021/02

Abstract

A chiller for fresh fruit and other perishable food products is cooled with a thermoelectric device and includes a cool air recirculating system that minimizes air flow path lengths and provides uniform cool air distribution throughout a fruit container removably supported above the thermoelectric module. The cooling air flow duct system is formed in part by the bottom wall of the container, thereby enhancing direct cooling air flow contact in minimizing the lengths of the flow paths.

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