Warpage compensating heat spreader
December 2, 2019. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent ReferencesSemiconductor heat removal apparatus with non-uniform conductance Metal matrix composite heat transfer device and method Encapsulation of electronic components Highly heat-radiating ceramic package Semiconductor device having a plated heat sink Semiconductor package for improving the capability of spreading heat Multichip module having a cover wtih support pillar Heat transfer apparatus suitable for use in a circuit board assembly Patent #: 5831826 InventorsApplicationNo. 453124 filed on 12/02/1999US Classes:361/705, By specific coating165/80.2, Electrical component165/185, HEAT TRANSMITTER174/16.3, With heat sink257/706, With heat sink257/713, For integrated circuit257/720, Heat dissipating element has high thermal conductivity insert (e.g., copper slug in aluminum heat sink)257/E23.092, Auxiliary members in encapsulations (EPO)361/710, Details361/718, For integrated circuit361/722For electronic circuitExaminersPrimary: Thompson, Gregory D.Attorney, Agent or FirmInternational ClassH05K 007/20AbstractA heat spreading cap is placed over a chip or integrated circuit. The cap is shaped or sized to provide a distinct heat spreading and/or stiffness characteristic that differs as it extends into different regions of the module. The areas of differing stiffness or CTE reduce the warpage (or bending) of the module, thereby reducing the overall stress in the BGA.Other References
Field of SearchElectrical componentAir cooled, including fins HEAT TRANSMITTER With provision for cooling the housing or its contents For integrated circuit Heat dissipating element has high thermal conductivity insert (e.g., copper slug in aluminum heat sink) Thermal conduction By specific coating Through support means Specific chemical compound or element Heat sink Details For active solid state devices For integrated circuit For electronic circuit | |
