Stacked multi-chip modules using C4 interconnect technology having improved thermal management
June 28, 2019. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent References 3787252 Interconnection in multi element planar structures Three-dimensional packaging of focal plane assemblies using ceramic spacers Heat pipe type cooling apparatus for semiconductor Flip substrate for chip mount Three-dimensional multichip module systems Three-dimensional multi-chip pad array carrier Stacking three dimensional leadless multi-chip module and method for making the same Composite flip chip semiconductor device with an interposer having test contacts formed along its periphery Multichip module having a stacked chip arrangement InventorAssigneeApplicationNo. 340419 filed on 06/28/1999US Classes:257/712, With provision for cooling the housing or its contents257/701, Insulating material257/778, Flip chip257/E21.511, Mounting on insulating member provided with metallic leads, e.g., flip-chip mounting, conductive die mounting (EPO)257/E23.011, Internal lead connections, e.g., via connections, feedthrough structures (EPO)257/E23.098, By flowing liquids (EPO)257/E25.013, Stacked arrangements of devices (EPO)438/122, Possessing thermal dissipation structure (i.e., heat sink)438/125Insulative housing or supportExaminersPrimary: Wilczewski, MaryAssistant: Goodwin, David Attorney, Agent or FirmInternational ClassH01L 023/52AbstractA flip-chip circuit arrangement having improved thermal management includes a base substrate having a top surface which includes one or more bond pads thereon. The arrangement further includes a semiconductor substrate having circuitry and one or more bond pads thereon, wherein the one or more bond pads on the semiconductor substrate correspond to the one or more bond pads on the base substrate. The semiconductor substrate has one or more channels which extend from a top surface to a bottom surface thereof and the channels facilitate a transfer of heat due to power dissipation of the circuitry away from the semiconductor substrate.Field of SearchINTEGRATED CIRCUIT STRUCTURE WITH ELECTRICALLY ISOLATED COMPONENTSChip mounted on chip Flip chip For plural devices With discrete components Stacked arrangement Via (interconnection hole) shape With electrical contact in hole in semiconductor (e.g., lead extends through semiconductor body) With specific housing or contact structure Liquid coolant Microwave integrated circuit (e.g., microstrip type) With contact or heat sink extending through hole in semiconductor substrate, or with electrode suspended over substrate (e.g., air bridge) With capacitive or inductive elements | |
