Method and apparatus for cleaning the surface of a semiconductor slice with a liquid spray of de-ionized water
Apparatus for washing semiconductor wafers
Electrodeposition of copper
Spin coating process
Molten salt lithium cells
Automatic analyzer and control system for electroplating baths
Electrodeposition of bright copper
ApplicationNo. 350210 filed on 07/09/1999
US Classes:204/232, Cells with electrolyte treatment means204/237, Recirculation204/238, With filter204/240, With filter204/267, Plural cells204/276, And filter204/286.1, With electrode supporting means204/287, Work container204/297.01, Electrode support or work holder204/297.03, Vacuum support204/297.08Mechanized
ExaminersPrimary: Bell, Bruce F.
Attorney, Agent or Firm
Foreign Patent References
International ClassC25B 015/00
AbstractThe present invention provides an electro-chemical deposition system that is designed with a flexible architecture that is expandable to accommodate future designs and gap fill requirements and provides satisfactory throughput to meet the demands of other processing systems. The electro-chemical deposition system generally comprises a mainframe having a mainframe wafer transfer robot, a loading station disposed in connection with the mainframe, one or more processing cells disposed in connection with the mainframe, and an electrolyte supply fluidly connected to the one or more electrical processing cells. Preferably, the electro-chemical deposition system includes an edge bead removal/spin-rinse-dry (EBR/SRD) station disposed on the mainframe adjacent the loading station, a rapid thermal anneal chamber attached to the loading station, a seed layer repair station disposed on the mainframe, and a system controller for controlling the electro-chemical deposition process and the components of the electro-chemical deposition system.