Post-ashing treating liquid compositions and a process for treatment therewith
June 2, 2019. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent ReferencesMethod of removing a cured epoxy from a metal surface Remover solution for resist Alkaline-containing photoresist stripping compositions producing reduced metal corrosion with cross-linked or hardened resist resins Remover solution composition for resist and method for removing resist using the same Remover solution composition for resist and method for removing resist using the same Aqueous rinsing composition Patent #: 5977041 InventorsAssigneeApplicationNo. 323988 filed on 06/02/1999US Classes:430/331, Finishing or perfecting composition or product430/325, Post image treatment to produce elevated pattern510/176For stripping photoresist materialExaminersPrimary: Le, Hoa VanAttorney, Agent or FirmForeign Patent References
International ClassG03F 007/40Foreign Application Priority Data1998-06-05 JPAbstractDisclosed herein is a post-ashing treating liquid composition comprising a salt of hydrofluoric acid with a base free from metal ions, a water-soluble organic solvent, water, and an acetylene alcohol/alkylene oxide adduct. Disclosed also herein is a process for treatment with said treating liquid composition. For removal of resist residues such as modified photoresist films and metal depositions, the treating liquid composition and the treating process can be advantageously applied to the substrates having been dry-etched, followed by ashing under severe conditions, without corrosion on metal layers and damage to an organic SOG layer formed thereon. |
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