Carrier head with a flexible membrane and adjustable edge pressure
July 8, 2019. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent ReferencesMethod for lapping a wafer material and an apparatus therefor Semiconductor wafer polishing using a hydrostatic medium Wafer polisher head having floating retainer ring Wafer-handling apparatus having a resilient membrane which holds wafer when a vacuum is applied Wafer carrier for film planarization Wafer polishing apparatus Polishing apparatus of semiconductor wafer Chemical mechanical polishing apparatus with improved carrier and method of use Chemical mechanical polishing apparatus with improved polishing control Pneumatic polishing head for CMP apparatus InventorApplicationNo. 09/349834 filed on 07/08/1999US Classes:451/288, Having pressure plate451/398Rotary work holderExaminersPrimary: Rose, Robert A.Attorney, Agent or FirmInternational ClassesB24B 41/06 (20060101)B24B 37/04 (20060101) AbstractA carrier head for a chemical mechanical polishing apparatus has a base, a flexible membrane extending beneath the base to define a pressurizable chamber, a retaining ring, and a spacer ring. At least one of the retaining ring and the spacer includes a projection or an indentation positioned adjacent a portion of the membrane that extends over the spacer, so that the pressure applied at a perimeter of the first membrane portion differs from the pressure applied in center of the first membrane portion.Other References
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