U.S. patents available from 1976 to present.
U.S. patent applications available from 2005 to present.

Fanless cooling system for computer

Patent 6234240 Issued on May 22, 2001. Estimated Expiration Date: Icon_subject July 1, 2019. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.

Patent References

3369597

3401744

3411570

3476177

3481393

Electronic cooling chassis
Patent #: 4027206
Issued on: 05/31/1977
Inventor: Lee

Cooling arrangement for plug-in module assembly
Patent #: 4315300
Issued on: 02/09/1982
Inventor: Parmerlee ,   et al.

Computer cooling system
Patent #: 4434625
Issued on: 03/06/1984
Inventor: Cree

Natural convection cooling system for electronic components
Patent #: 4535386
Issued on: 08/13/1985
Inventor: Frey, Jr. ,   et al.

System cooler for a computer
Patent #: 4643245
Issued on: 02/17/1987
Inventor: Smoot, III ,   et al.

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Inventor

Application

No. 346281 filed on 07/01/1999

US Classes:

165/80.3, Air cooled, including fins62/3.2, Thermoelectric; e.g., peltier effect165/80.4, Liquid cooled165/185, HEAT TRANSMITTER257/714, Liquid coolant361/700Change of physical state

Examiners

Primary: Atkinson, Christopher

Attorney, Agent or Firm

International Class

F28F 007/00

Abstract

A computer (2) has a plurality of heat-producing components, including a microprocessor chip (10). A heat transfer device (22) through which a liquid coolant (C) is circulated is mounted in heat exchanging contact on the component (10). The device (22) may be mounted directly or via a Peltier thermoelectric cooler (14) positioned between the component (10) and the device (22). Coolant (C) from the device (22) is circulated to and through a reservoir (42) mounted on an inner mounting surface (38) of a radiator (34). The radiator (34) has heat dissipating fins (40) exposed to ambient air. The power supply (6) of the computer (2) is mounted directly on the mounting surface (38) so that heat produced by the power supply (6) will be dissipated by the radiator (34). Preferably, a plurality of transistors (66) of the power supply (6) are mounted on the mounting surface (38) separately from the mounting board (64) of the power supply 6).

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