Method of making wires scribed circuit boards
Wiring method and apparatus for electronic circuit boards or the like
Automated method for the manufacture of small implantable transponder devices
Method and apparatus for transducer heating in low temperature bonding
Process for assembling a coil on a printed circuit
Apparatus and method for laying a wire
Method for producing a smart card module for contactless smart cards Patent #: 5809633
ApplicationNo. 117970 filed on 08/07/1998
US Classes:29/843, By metal fusion bonding29/600, Antenna or wave energy "plumbing" making29/827, Beam lead frame or beam lead device235/382Permitting access
ExaminersPrimary: Arbes, Carl J.
Attorney, Agent or Firm
Foreign Patent References
International ClassH05K 003/00
Foreign Application Priority Data1996-02-12 DE
AbstractProcess and device for the contacting of a wire conductor (113) in the course of the manufacture of a transponder unit arranged on a substrate (111) and comprising a wire coil (112) and a chip unit (115), wherein in a first phase the wire conductor (113) is guided away via the terminal area (118, 119) or a region accepting the terminal area and is fixed on the substrate (111) relative to the terminal area (118, 119) or the region assigned to the terminal area, and in a second phase the connection of the wire conductor (113) to the terminal area (118,119) is effected by means of a connecting instrument (125).