Method and device for bonding a wire conductor

Patent 6233818 Issued on May 22, 2001. Estimated Expiration Date:

August 7, 2018. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.

Abstract Claims Description Full Text

Patent References

3079672

3353263

Method of making wires scribed circuit boards
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Inventors

Application

No. 117970 filed on 08/07/1998

US Classes:

29/843, By metal fusion bonding29/600, Antenna or wave energy "plumbing" making29/827, Beam lead frame or beam lead device235/382Permitting access

Examiners

Primary: Arbes, Carl J.

Attorney, Agent or Firm

McGlew and Tuttle, P.C.

Foreign Patent References

36 24 630 A1 DE. 02/19/1987
43 25 334 A1 DE. 12/19/1994
44 08 124 A1 DE. 09/19/1995
44 107 32 A1 DE. 10/19/1995
0 535 433 A2 EP. 04/19/1993
0 689 164 A2 EP. 12/19/1995
2 555 007 A1 FR. 05/19/1985
624369 GB. 06/19/2013
62-008313 JP. 01/19/1987
WO 91/16718 WO. 10/19/1991
WO 93/20537 WO. 10/19/1993
WO 94/28562 WO. 12/19/1994
WO 96/07984 WO. 03/19/1996

International Class

H05K 003/00

Foreign Application Priority Data

1996-02-12 DE

Abstract

Process and device for the contacting of a wire conductor (113) in the course of the manufacture of a transponder unit arranged on a substrate (111) and comprising a wire coil (112) and a chip unit (115), wherein in a first phase the wire conductor (113) is guided away via the terminal area (118, 119) or a region accepting the terminal area and is fixed on the substrate (111) relative to the terminal area (118, 119) or the region assigned to the terminal area, and in a second phase the connection of the wire conductor (113) to the terminal area (118,119) is effected by means of a connecting instrument (125).