U.S. patents available from 1976 to present.
U.S. patent applications available from 2005 to present.

Method of measuring overlay offset

Patent 6233494 Issued on May 15, 2001. Estimated Expiration Date: Icon_subject August 22, 2017. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.

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Inventor

Assignee

Application

No. 916337 filed on 08/22/1997

US Classes:

700/121, Integrated circuit production or semiconductor fabrication716/21Pattern exposure

Examiners

Primary: Gordon, Paul P.

Attorney, Agent or Firm

International Class

G06F 019/00

Foreign Application Priority Data

1996-08-23 JP

Abstract

A method of measuring the overlay offset of a resist pattern formed on a semiconductor wafer is disclosed. An aligner outputs wafer-by-wafer measured alignment data. A scattering of the wafer-by-wafer alignment data is calculated. If the scattering is greater than a preselected value, all the wafers of a lot brought to a measuring step are tested. If the scattering is smaller than the preselected value, only sample wafers are tested. Whether or not sampling should be effected is automatically determined.

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