U.S. patents available from 1976 to present.
U.S. patent applications available from 2005 to present.

Thermoelectric element and thermoelectric cooling or heating device provided with the same

Patent 6226994 Issued on May 8, 2001. Estimated Expiration Date: Icon_subject March 1, 2019. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.

Patent References

Thermoelectric cooler and fabrication method
Patent #: 5171372
Issued on: 12/15/1992
Inventor: Recine, Sr.

Thermoelectric cooler Patent #: 5441576
Issued on: 08/15/1995
Inventor: Bierschenk, et al.

Inventors

Assignee

Application

No. 254122 filed on 03/01/1999

US Classes:

62/3.7, Including specific circuitry or heat exchanger material62/3.2, Thermoelectric; e.g., peltier effect136/203Peltier effect device

Examiners

Primary: McDermott, Corrine
Assistant: Jiang, Chen-Wen

Attorney, Agent or Firm

Foreign Patent References

  • 34-595 JP. 02/13/2012
  • 361172358 JP. 08/13/1986
  • 405160441 JP. 06/13/1993
  • 405175556 JP. 07/13/1993
  • 8-228027 JP. 09/13/1996

International Class

F25B 021/02

Foreign Application Priority Data

1997-07-02 JP

Abstract

A thermoelectric element (1) comprises a partitioning plate (2) having electrical insulating properties; equal numbers of p-type thermoelectric semiconductor elements (3A) and n-type thermoelectric semiconductor elements (3B) fixed to the partitioning plate (2) in a state in which they pass through the partitioning plate (2); flat copper electrodes (4) fixed to upper sides of the p-type thermoelectric semiconductor elements (3A) and n-type thermoelectric semiconductor elements (3B); and T-shaped copper electrodes (5) fixed to lower sides of the p-type thermoelectric semiconductor elements (3A) and n-type thermoelectric semiconductor elements (3B). Lower portions protruding from the lower surface of the partitioning plate (2) are accommodated within a cooling vessel and are cooled directly by a coolant or air.

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